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XC228796F66LACKXUMA1

Infineon Technologies

XC228796F66LACKXUMA1 by Infineon Technologies

Infineon's XC228796F66LACKXUMA1 microcontroller features 32-bit architecture, 24-bit address bus, and 16-bit external data bus. Ideal for automotive applications with a temperature range of -40 to 125 °C, it offers PWM channels, ADC support, and operates at up to 40 MHz clock frequency.

Median Price

$18.010

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$18.010

100+ parts

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100

$18.010

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Vyrian

USA . 4,205 parts In-Stock

1+ parts

-

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4,205

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Digiode

USA . 272 parts In-Stock

1+ parts

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272

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 401 parts In-Stock

1+ parts

$5.017

100+ parts

-

1k+ parts

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401

$5.017

-

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Semicontronic

India . 773 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

10k+ parts

-

773

$6.000

$5.850

$5.820

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Ampacity Inc.

Singapore . 1,618 parts In-Stock

1+ parts

$13.000

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1,618

$13.000

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Continental Prestige Electronics

USA . 3,619 parts In-Stock

1+ parts

$18.010

100+ parts

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$17.650

3,619

$18.010

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$17.650

Netroflash

USA . 100 parts In-Stock

1+ parts

$18.010

100+ parts

-

1k+ parts

$17.110

10k+ parts

$16.749

100

$18.010

-

$17.110

$16.749

Corohmni

South Africa . 731 parts In-Stock

1+ parts

$22.011

100+ parts

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731

$22.011

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Aztec Data Supply Inc.

USA . 3,394 parts In-Stock

1+ parts

$35.020

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3,394

$35.020

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Microchip USA

USA . 1,654 parts In-Stock

1+ parts

$37.653

100+ parts

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1,654

$37.653

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Modulus Dynamics

Lithuania . 1,711 parts In-Stock

1+ parts

$51.628

100+ parts

$49.563

1k+ parts

$47.498

10k+ parts

-

1,711

$51.628

$49.563

$47.498

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QUARKTWIN TECHNOLOGY LTD

USA . 28,828 parts In-Stock

1+ parts

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28,828

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Argo Parts USA

USA . 1,390 parts In-Stock

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1,390

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Corphita

USA . 90 parts In-Stock

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90

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Overview

Discover the XC228796F66LACKXUMA1 by Infineon Technologies, a top-tier microcontroller that boasts unparalleled quality and reliability. Manufactured by Infineon Technologies, a renowned leader in the industry, this microcontroller offers a wide range of applications in various fields. With its cutting-edge features and advanced technology, customers can expect exceptional performance, efficiency, and versatility. Experience the value and benefits that this product brings to your projects, whether in automotive, industrial, or consumer electronics applications. Elevate your designs with the XC228796F66LACKXUMA1 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring reliable performance in various environments.

Surface Mount: YES

Allows for easy mounting on PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 1.6 V

Provides a safe operating range for the microcontroller, preventing damage from overvoltage.

Address Bus Width: 24

Enables the microcontroller to access a larger memory space, increasing processing capabilities.

Package Shape: SQUARE

Facilitates efficient PCB layout and space utilization, making it suitable for compact designs.

Bit Size: 32

Allows the microcontroller to process data in 32-bit chunks, enhancing performance and computational capabilities.

No. of Terminals: 144

Provides ample connectivity options for interfacing with other components and peripherals.

Terminal Finish: MATTE TIN

Ensures good solderability and reliable electrical connections for long-term use.

Maximum Operating Temperature: 125 °C

Allows the microcontroller to operate in high-temperature environments, suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Ensures the microcontroller can withstand low-temperature conditions, making it versatile for various operating environments.

ADC Channels: YES

Enables analog-to-digital conversion, allowing the microcontroller to interface with sensors and analog devices.

External Data Bus Width: 16

Facilitates efficient data transfer between the microcontroller and external memory or devices, improving overall system performance.

Technical Specifications

Microcontrollers XC228796F66LACKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

115

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

XC228796F66LACKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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