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XC2267M104F80LRABKXUMA1

Infineon Technologies

XC2267M104F80LRABKXUMA1 by Infineon Technologies

Infineon XC2267M104F80LRABKXUMA1 is a 32-bit microcontroller with 24-bit address bus width, 16-Ch 10-Bit ADC channels, and 32768 bytes of RAM. Ideal for automotive applications, it offers connectivity options like CAN, I2C, LIN, SPI, and UART along with peripherals such as POR and RTC. Operating at up to 40 MHz with a temperature range of -40 to 125 °C, this CMOS technology-based MCU is designed for high-performance tasks in automotive systems.

Median Price

$12.944

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 33 parts In-Stock

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$12.944

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Vyrian

USA . 6,564 parts In-Stock

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Chip Stock

USA . 6,500 parts In-Stock

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Digiode

USA . 284 parts In-Stock

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Semicontronic

India . 1,458 parts In-Stock

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$3.000

100+ parts

$2.925

1k+ parts

$2.910

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$3.000

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$2.910

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Ampacity Inc.

Singapore . 439 parts In-Stock

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$4.000

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439

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AZTECH Wire

Italy . 292 parts In-Stock

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$10.766

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Corohmni

South Africa . 533 parts In-Stock

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$11.256

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533

$11.256

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Modulus Dynamics

Lithuania . 444 parts In-Stock

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$11.256

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$10.806

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$10.356

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Aranea Global

USA . 100 parts In-Stock

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$12.685

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$12.178

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100

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Continental Prestige Electronics

USA . 5,897 parts In-Stock

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$12.944

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Aztec Data Supply Inc.

USA . 2,306 parts In-Stock

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$43.490

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Component Stockers USA

USA . 642 parts In-Stock

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$99.990

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Lixinc

USA . 7,389 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Microchip USA

USA . 4,678 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,237 parts In-Stock

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Argo Parts USA

USA . 3,812 parts In-Stock

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Corphita

USA . 651 parts In-Stock

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Overview

Unlock the potential of your automotive applications with the XC2267M104F80LRABKXUMA1 by Infineon Technologies. This high-quality microcontroller offers unrivaled performance and reliability, making it the ideal choice for a wide range of automotive electronics. With advanced features such as 16-channel ADC converters and 10-bit PWM channels, this product delivers exceptional value and efficiency to customers. Trust in Infineon Technologies to provide cutting-edge solutions for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

With surface mount capabilities, this microcontroller can be easily integrated onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.6 V

The high maximum supply voltage allows for flexibility in power requirements, making this microcontroller suitable for a wide range of applications.

Address Bus Width: 24

A wide address bus width of 24 allows for efficient data processing and memory access, enhancing the performance of the microcontroller.

Package Shape: SQUARE

The square package shape offers a compact design, making it easier to mount and integrate into electronic devices.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex calculations and processes efficiently, making it a powerful choice for demanding applications.

No. of Terminals: 100

The large number of terminals provides connectivity options for various peripherals and external components, enhancing the versatility of the microcontroller.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The multiple package styles offer flexibility in design and integration, allowing for customization based on specific project requirements.

Minimum Supply Voltage: 1.4 V

The low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources, making this microcontroller suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, making it suitable for industrial and automotive applications.

Technical Specifications

Microcontrollers XC2267M104F80LRABKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

32768

ROM Words:

851968

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), I2C, I2S, LIN, RS-232, SPI, SSC, UART

Peripherals:

POR, RTC, TIMER(12), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

XC2267M104F80LRABKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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