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XC2269I136F128LRAAKXUMA1

Infineon Technologies

XC2269I136F128LRAAKXUMA1 by Infineon Technologies

Infineon Technologies' XC2269I136F128LRAAKXUMA1 microcontroller features 32-bit architecture, 24-bit address bus width, and 40 MHz max clock frequency. Ideal for automotive applications with CAN, I2C, LIN connectivity and ADC channels for precise analog to digital conversion. Operating temperature range from -40°C to 125°C makes it suitable for harsh environments.

Median Price

$18.169

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 520 parts In-Stock

1+ parts

-

100+ parts

$16.150

1k+ parts

$14.450

10k+ parts

$13.600

520

-

$16.150

$14.450

$13.600

Verical

USA . 520 parts In-Stock

1+ parts

-

100+ parts

$20.188

1k+ parts

$18.063

10k+ parts

$17.000

520

-

$20.188

$18.063

$17.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$9.561

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$9.561

-

-

-

Digiode

USA . 629 parts In-Stock

1+ parts

$17.081

100+ parts

-

1k+ parts

-

10k+ parts

-

629

$17.081

-

-

-

Vyrian

USA . 7,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,622

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 863 parts In-Stock

1+ parts

$10.070

100+ parts

-

1k+ parts

-

10k+ parts

-

863

$10.070

-

-

-

Ampacity Inc.

Singapore . 70 parts In-Stock

1+ parts

$15.280

100+ parts

-

1k+ parts

-

10k+ parts

-

70

$15.280

-

-

-

Corphita

USA . 760 parts In-Stock

1+ parts

$16.182

100+ parts

-

1k+ parts

-

10k+ parts

-

760

$16.182

-

-

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Modulus Dynamics

Lithuania . 3,604 parts In-Stock

1+ parts

$21.105

100+ parts

$20.261

1k+ parts

$19.417

10k+ parts

-

3,604

$21.105

$20.261

$19.417

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$25.856

100+ parts

$23.529

1k+ parts

$21.202

10k+ parts

-

2,000

$25.856

$23.529

$21.202

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Microchip USA

USA . 1,952 parts In-Stock

1+ parts

$50.741

100+ parts

-

1k+ parts

-

10k+ parts

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1,952

$50.741

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 16,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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16,320

-

-

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Overview

Elevate your projects with the XC2269I136F128LRAAKXUMA1 microcontroller from Infineon Technologies. Known for their cutting-edge technology and superior quality, Infineon delivers top-of-the-line solutions for various applications. This automotive-grade microcontroller offers unmatched performance and reliability, featuring a wide range of peripherals such as PWM, RTC, and more. With a maximum clock frequency of 40 MHz and 73 I/O lines, this versatile device provides endless possibilities for your next project. Upgrade to the XC2269I136F128LRAAKXUMA1 and experience the difference in performance and efficiency today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy packaging provides durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 1.6 V

Wide supply voltage range allows for flexibility in powering the microcontroller and compatibility with different voltage sources.

Address Bus Width: 24

Having a 24-bit address bus width allows for access to a larger memory space, enabling the microcontroller to handle more complex tasks and store more data.

Bit Size: 32

With a 32-bit architecture, the microcontroller can process data and instructions in larger chunks, improving overall performance and efficiency.

ROM Words: 1114112

Large ROM capacity provides ample storage for program instructions and data, allowing for versatile programming options and functionality.

Maximum Clock Frequency: 40 MHz

High clock frequency enhances the processing speed of the microcontroller, enabling quick execution of commands and efficient operation.

RAM Bytes: 100352

Generous RAM capacity allows for temporary storage of data during operation, facilitating smooth and seamless processing of complex tasks.

Analog To Digital Convertors: 19-Ch 12-Bit

Multiple ADC channels with high resolution provide accurate analog to digital conversion, allowing the microcontroller to interface with a wide range of sensors and external devices.

Connectivity: CAN(6), I2C(10), I2S(10), LIN(10), SPI(10), SSC(10), UART(10), USI(10)

Diverse connectivity options enable the microcontroller to communicate with various peripherals and devices, expanding its compatibility and versatility in different systems.

Technical Specifications

Microcontrollers XC2269I136F128LRAAKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

73

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

100352

ROM Words:

1114112

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

128 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(6), I2C(10), I2S(10), LIN(10, SPI(10), SSC(10), UART(10), USI(10)

Peripherals:

POR, PWM(4), RTC, TIMER(6), WDT

Analog To Digital Convertors:

19-Ch 12-Bit

Trade Compliance

XC2269I136F128LRAAKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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