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TT190N16SOFHPSA2

Infineon Technologies

TT190N16SOFHPSA2 by Infineon Technologies

TT190N16SOFHPSA2 by Infineon Technologies is a Silicon Controlled Rectifier with 1600V repetitive peak reverse voltage and 275A max RMS on-state current. It features a series connected, center tap configuration with 2 elements, suitable for applications requiring high power control such as industrial motor drives and power supplies. Operating temperature ranges from -40°C to 125°C.

Median Price

$50.410

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 6 parts In-Stock

1+ parts

$43.600

100+ parts

-

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6

$43.600

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Chip1Stop

Japan . 6 parts In-Stock

1+ parts

$48.400

100+ parts

-

1k+ parts

$37.000

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6

$48.400

-

$37.000

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Element14

Singapore . 8 parts In-Stock

1+ parts

$48.650

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8

$48.650

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Mouser Electronics

USA . 99 parts In-Stock

1+ parts

$52.170

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99

$52.170

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DigiKey

USA . 167 parts In-Stock

1+ parts

$52.990

100+ parts

$38.384

1k+ parts

$38.300

10k+ parts

-

167

$52.990

$38.384

$38.300

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Newark

USA . 7 parts In-Stock

1+ parts

$53.060

100+ parts

$45.090

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-

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7

$53.060

$45.090

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 175 parts In-Stock

1+ parts

$36.290

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175

$36.290

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TME

Poland . 16 parts In-Stock

1+ parts

$50.600

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16

$50.600

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Vyrian

USA . 7,597 parts In-Stock

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7,597

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,630 parts In-Stock

1+ parts

$2.401

100+ parts

$2.305

1k+ parts

$2.209

10k+ parts

-

3,630

$2.401

$2.305

$2.209

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Corphita

USA . 184 parts In-Stock

1+ parts

$34.380

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184

$34.380

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Component Stockers USA

USA . 190 parts In-Stock

1+ parts

$43.900

100+ parts

$41.040

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190

$43.900

$41.040

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Microchip USA

USA . 9,656 parts In-Stock

1+ parts

$133.722

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9,656

$133.722

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Perfect Parts

USA . 833 parts In-Stock

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833

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Overview

Unlock the power of cutting-edge technology with the TT190N16SOFHPSA2 by Infineon Technologies. As a leader in the industry, Infineon guarantees top-notch quality and reliability. This Silicon Controlled Rectifier is designed for optimum performance, making it ideal for a wide range of applications. Experience seamless operation and enhanced efficiency with this SCR that boasts a maximum RMS On-state Current of 275 A and a Repetitive Peak Reverse Voltage of 1600 V. Trust Infineon to deliver superior products that exceed your expectations. Elevate your projects with the TT190N16SOFHPSA2 and see the difference for yourself.

Feature Benefit Bullets

Maximum DC Gate Trigger Current: 145 mA

Ensures reliable trigger control for the SCR, allowing for precise operation.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Provides a stable and efficient setup for the SCR with two elements connected in series.

Repetitive Peak Reverse Voltage: 1600 V

Offers a high reverse voltage tolerance for added safety and protection.

Maximum RMS On-state Current: 275 A

Allows for high current handling capacity, making it suitable for demanding applications.

Maximum Operating Temperature: 125 °C

Can operate efficiently under high temperature conditions without compromising performance.

Minimum Operating Temperature: -40 °C

Maintains functionality in low temperature environments, ensuring versatility.

Package Style (Meter): FLANGE MOUNT

Facilitates easy mounting and installation in various equipment configurations.

Case Connection: ISOLATED

Provides electrical isolation for improved safety and reliability in circuit applications.

Reference Standard: IEC-747-6; UL RECOGNIZED

Compliance with international standards ensures quality and reliability of the product.

Technical Specifications

Silicon Controlled Rectifiers (SCR) TT190N16SOFHPSA2 attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from Infineon Technologies

Specs

Case Connection:

Maximum DC Gate Trigger Current:

145 mA

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum RMS On-state Current:

275 A

Reference Standard:

IEC-747-6; UL RECOGNIZED

Repetitive Peak Off-state Voltage:

1600 V

Repetitive Peak Reverse Voltage:

1600 V

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

SCR

Trade Compliance

TT190N16SOFHPSA2 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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