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TLE7244SLXUMA2

Infineon Technologies

TLE7244SLXUMA2 by Infineon Technologies

TLE7244SLXUMA2 by Infineon is a 24-terminal peripheral driver with built-in protections for transient, over current, and thermal issues. It operates at supply voltages b/w 3V to 5.5V, with a turn-on/off time of 50us. This small outline IC is ideal for buffer or inverter-based applications requiring a max output peak current limit of 0.29A.

Median Price

$4.595

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 10,087 parts In-Stock

1+ parts

$4.310

100+ parts

$2.720

1k+ parts

$2.433

10k+ parts

$2.361

10,087

$4.310

$2.720

$2.433

$2.361

Newark

USA . 2,786 parts In-Stock

1+ parts

$4.880

100+ parts

$3.080

1k+ parts

$2.760

10k+ parts

-

2,786

$4.880

$3.080

$2.760

-

Element14

Singapore . 286 parts In-Stock

1+ parts

$6.240

100+ parts

$3.950

1k+ parts

$3.540

10k+ parts

-

286

$6.240

$3.950

$3.540

-

Farnell

UK . 286 parts In-Stock

1+ parts

-

100+ parts

$2.340

1k+ parts

$2.100

10k+ parts

-

286

-

$2.340

$2.100

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$2.930

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$2.930

-

-

-

Digiode

USA . 33 parts In-Stock

1+ parts

$3.752

100+ parts

-

1k+ parts

-

10k+ parts

-

33

$3.752

-

-

-

Chip Stock

USA . 21,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21,700

-

-

-

-

Vyrian

USA . 4,068 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,068

-

-

-

-

A&K Electronics

USA . 235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

235

-

-

-

-

Rotakorn

Sweden . 235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

235

-

-

-

-

Bristol Electronics

USA . 235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

235

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,686 parts In-Stock

1+ parts

$2.050

100+ parts

-

1k+ parts

-

10k+ parts

-

3,686

$2.050

-

-

-

Modulus Dynamics

Lithuania . 2,278 parts In-Stock

1+ parts

$2.358

100+ parts

$2.264

1k+ parts

$2.169

10k+ parts

-

2,278

$2.358

$2.264

$2.169

-

Semicontronic

India . 3,507 parts In-Stock

1+ parts

$2.790

100+ parts

$2.720

1k+ parts

$2.706

10k+ parts

-

3,507

$2.790

$2.720

$2.706

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

$2.871

100+ parts

-

1k+ parts

$2.757

10k+ parts

-

50

$2.871

-

$2.757

-

Argo Parts USA

USA . 2,129 parts In-Stock

1+ parts

$2.884

100+ parts

-

1k+ parts

-

10k+ parts

-

2,129

$2.884

-

-

-

Corphita

USA . 770 parts In-Stock

1+ parts

$3.555

100+ parts

-

1k+ parts

-

10k+ parts

-

770

$3.555

-

-

-

GreenTree Electronics

Israel . 19,974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,974

-

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

RC Electronics

USA . 8,624 parts In-Stock

1+ parts

-

100+ parts

$3.320

1k+ parts

$3.030

10k+ parts

$2.940

8,624

-

$3.320

$3.030

$2.940

Continental Prestige Electronics

USA . 6,901 parts In-Stock

1+ parts

-

100+ parts

$2.400

1k+ parts

$1.720

10k+ parts

-

6,901

-

$2.400

$1.720

-

Perfect Parts

USA . 5,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,600

-

-

-

-

Microchip USA

USA . 4,401 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,401

-

-

-

-

Overview

Unlock the power of innovation with the TLE7244SLXUMA2 by Infineon Technologies. Crafted with precision and expertise, this peripheral driver offers unrivaled quality and reliability. From automotive to industrial applications, this versatile component provides built-in protections against transient events, overcurrent situations, and thermal issues. With a compact package design and superior performance, customers can trust in the value and benefits that this product brings to their projects. Elevate your designs with the TLE7244SLXUMA2 and experience the Infineon advantage today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Supports a high maximum supply voltage, providing flexibility in various electronic applications.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

Built-in protections enhance safety and reliability by safeguarding against transient voltage spikes, overcurrent conditions, and thermal issues.

No. of Terminals: 24

Having 24 terminals allows for connectivity to multiple components, increasing versatility in circuit design.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch design contribute to space-saving and compact integration in electronic devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a common and widely supported standard in many electronic systems, ensuring compatibility.

Turn-on Time: 50 us

Fast turn-on time of 50 microseconds enhances responsiveness and efficiency in signal processing.

Nominal Output Peak Current Limit: 0.29 A

The high nominal output peak current limit of 0.29A allows for driving various peripheral devices with sufficient current.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter based peripheral driver offers versatility in signal processing and interfacing with external devices.

Technical Specifications

Peripheral Drivers TLE7244SLXUMA2 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

.29 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

50 us

Turn-on Time:

50 us

Width:

3.9 mm

Trade Compliance

TLE7244SLXUMA2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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