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TLE7240SLXUMA1

Infineon Technologies

TLE7240SLXUMA1 by Infineon Technologies

TLE7240SLXUMA1 by Infineon Technologies is an AEC-Q100 compliant peripheral driver with 24 terminals and a max output current of 0.5A. It operates on power supplies of 3.3/5.5V, suitable for automotive applications requiring a sink-type output current flow direction in a small outline package style.

Median Price

$1.398

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19,464 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.180

10k+ parts

$1.110

19,464

-

$1.320

$1.180

$1.110

Verical

USA . 19,464 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.475

10k+ parts

$1.387

19,464

-

-

$1.475

$1.387

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 415 parts In-Stock

1+ parts

$1.387

100+ parts

-

1k+ parts

-

10k+ parts

-

415

$1.387

-

-

-

Vyrian

USA . 2,516 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,516

-

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 19,196 parts In-Stock

1+ parts

$1.240

100+ parts

$1.209

1k+ parts

$1.203

10k+ parts

-

19,196

$1.240

$1.209

$1.203

-

Corphita

USA . 643 parts In-Stock

1+ parts

$1.314

100+ parts

-

1k+ parts

-

10k+ parts

-

643

$1.314

-

-

-

Ampacity Inc.

Singapore . 19,308 parts In-Stock

1+ parts

$2.700

100+ parts

-

1k+ parts

-

10k+ parts

-

19,308

$2.700

-

-

-

Modulus Dynamics

Lithuania . 4,787 parts In-Stock

1+ parts

$6.565

100+ parts

$6.302

1k+ parts

$6.040

10k+ parts

-

4,787

$6.565

$6.302

$6.040

-

AZTECH Wire

Italy . 394 parts In-Stock

1+ parts

$8.270

100+ parts

-

1k+ parts

-

10k+ parts

-

394

$8.270

-

-

-

Continental Prestige Electronics

USA . 4,765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,765

-

-

-

-

Argo Parts USA

USA . 2,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,062

-

-

-

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Kepictronics

USA . 1,249 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,249

-

-

-

-

Microchip USA

USA . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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350

-

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Unlock the potential of your electronic designs with the TLE7240SLXUMA1 by Infineon Technologies. As a leader in peripheral drivers, Infineon Technologies delivers unparalleled quality and reliability. This versatile product offers customers the value of precise power control, optimized performance, and seamless integration. Whether you are designing automotive electronics, industrial automation systems, or consumer electronics, the TLE7240SLXUMA1 provides the ultimate solution for your application needs. Elevate your designs with the unmatched benefits and advantages of this cutting-edge product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making it suitable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving time and effort during production.

Screening Level: AEC-Q100

This high screening level ensures reliability and performance in automotive applications, making it a dependable choice for automotive electronics.

Package Shape: RECTANGULAR

The rectangular shape saves space on the PCB, making it ideal for compact designs or when space is limited.

Power Supplies (V): 3.3/5,5

With multiple power supply options, this product can be versatile and compatible with different systems, enhancing its usability.

No. of Terminals: 24

The high number of terminals allows for more connections and functionalities, making it suitable for complex applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and helps optimize the overall design of the electronics.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout and allow for efficient routing of connections, enhancing the overall design.

Maximum Output Current: 0.5 A

The high maximum output current capability makes this product suitable for driving a variety of loads, adding to its versatility.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering, ensuring reliable connections in various applications.

Terminal Pitch: 0.635 mm

The small terminal pitch allows for high-density mounting and space-saving on the PCB, making it ideal for compact designs.

Driver No. of Bits: 8

The 8-bit driver allows for precise control and customization of peripheral devices, offering flexibility in system design and integration.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product's ability to withstand exposure to moisture, ensuring reliability in diverse environmental conditions.

Nominal Output Peak Current Limit: 0.21 A

The nominal output peak current limit helps protect the driver and connected devices from overcurrent situations, enhancing overall system safety.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based interface IC type provides versatility in interfacing with different peripheral devices, making it a versatile solution for various applications.

Output Current Flow Direction: SINK

The sink output current flow direction allows for efficient sinking of current from connected devices, ensuring proper operation and reliability.

Technical Specifications

Peripheral Drivers TLE7240SLXUMA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Driver No. of Bits:

8

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

24

Output Current Flow Direction:

SINK

Maximum Output Current:

.5 A

Nominal Output Peak Current Limit:

.21 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5,5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

TLE7240SLXUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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