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TLE75602ESDXUMA1

Infineon Technologies

TLE75602ESDXUMA1 by Infineon Technologies

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 2A; Terminal Finish: TIN;

Median Price

$2.400

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 572 parts In-Stock

1+ parts

$1.281

100+ parts

$1.028

1k+ parts

$0.923

10k+ parts

-

572

$1.281

$1.028

$0.923

-

Chip1Stop

Japan . 5,824 parts In-Stock

1+ parts

$2.010

100+ parts

$1.377

1k+ parts

-

10k+ parts

$1.376

5,824

$2.010

$1.377

-

$1.376

Newark

USA . 2,440 parts In-Stock

1+ parts

$2.400

100+ parts

$1.460

1k+ parts

$1.290

10k+ parts

-

2,440

$2.400

$1.460

$1.290

-

DigiKey

USA . 5,025 parts In-Stock

1+ parts

$2.570

100+ parts

$1.556

1k+ parts

$1.373

10k+ parts

$1.294

5,025

$2.570

$1.556

$1.373

$1.294

Mouser Electronics

USA . 2,247 parts In-Stock

1+ parts

$2.570

100+ parts

$1.560

1k+ parts

$1.280

10k+ parts

$1.180

2,247

$2.570

$1.560

$1.280

$1.180

Farnell

UK . 2,850 parts In-Stock

1+ parts

$2.590

100+ parts

$1.690

1k+ parts

$1.210

10k+ parts

-

2,850

$2.590

$1.690

$1.210

-

Element14

Singapore . 2,850 parts In-Stock

1+ parts

$3.900

100+ parts

$2.870

1k+ parts

$2.070

10k+ parts

$1.970

2,850

$3.900

$2.870

$2.070

$1.970

Rochester

USA . 80,226 parts In-Stock

1+ parts

-

100+ parts

$1.330

1k+ parts

$1.100

10k+ parts

$0.984

80,226

-

$1.330

$1.100

$0.984

Verical

USA . 77,779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.375

10k+ parts

$1.230

77,779

-

-

$1.375

$1.230

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 179 parts In-Stock

1+ parts

$1.387

100+ parts

-

1k+ parts

-

10k+ parts

-

179

$1.387

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$1.956

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$1.956

-

-

-

Vyrian

USA . 22,688 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,688

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 23,127 parts In-Stock

1+ parts

$1.240

100+ parts

-

1k+ parts

-

10k+ parts

-

23,127

$1.240

-

-

-

Semicontronic

India . 23,035 parts In-Stock

1+ parts

$1.240

100+ parts

$1.209

1k+ parts

$1.203

10k+ parts

-

23,035

$1.240

$1.209

$1.203

-

Corphita

USA . 877 parts In-Stock

1+ parts

$1.314

100+ parts

-

1k+ parts

-

10k+ parts

-

877

$1.314

-

-

-

Argo Parts USA

USA . 4,242 parts In-Stock

1+ parts

$1.950

100+ parts

-

1k+ parts

-

10k+ parts

-

4,242

$1.950

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$1.956

100+ parts

-

1k+ parts

$1.858

10k+ parts

$1.819

50

$1.956

-

$1.858

$1.819

Continental Prestige Electronics

USA . 2,900 parts In-Stock

1+ parts

$2.440

100+ parts

$1.590

1k+ parts

$1.370

10k+ parts

-

2,900

$2.440

$1.590

$1.370

-

Corohmni

South Africa . 65 parts In-Stock

1+ parts

$6.374

100+ parts

-

1k+ parts

-

10k+ parts

-

65

$6.374

-

-

-

Microchip USA

USA . 2,716 parts In-Stock

1+ parts

$9.752

100+ parts

-

1k+ parts

-

10k+ parts

-

2,716

$9.752

-

-

-

Modulus Dynamics

Lithuania . 619 parts In-Stock

1+ parts

$13.718

100+ parts

$13.169

1k+ parts

$12.621

10k+ parts

-

619

$13.718

$13.169

$12.621

-

Aztec Data Supply Inc.

USA . 10,304 parts In-Stock

1+ parts

$14.272

100+ parts

-

1k+ parts

-

10k+ parts

-

10,304

$14.272

-

-

-

Technical Specifications

Peripheral Drivers TLE75602ESDXUMA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2A

Terminal Finish:

TIN

Trade Compliance

TLE75602ESDXUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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