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TLE62086GXT

Infineon Technologies

TLE62086GXT by Infineon Technologies

Infineon's TLE62086GXT is a Motion Control IC for brush DC motors. It operates at 4.75-5.25V with 2A output current, utilizing BCDMOS technology. With 28 terminals in a small outline package, it's ideal for compact applications requiring precise motor control.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,052 parts In-Stock

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1,052

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Digiode

USA . 482 parts In-Stock

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482

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Nova Conductors

Japan . 33 parts In-Stock

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33

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Distributors (Availability)

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Ampacity Inc.

Singapore . 346 parts In-Stock

1+ parts

$6.500

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346

$6.500

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AZTECH Wire

Italy . 565 parts In-Stock

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$13.216

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565

$13.216

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Modulus Dynamics

Lithuania . 3,838 parts In-Stock

1+ parts

$15.118

100+ parts

$14.513

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$13.909

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3,838

$15.118

$14.513

$13.909

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Continental Prestige Electronics

USA . 4,996 parts In-Stock

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Argo Parts USA

USA . 4,130 parts In-Stock

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4,130

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Corphita

USA . 55 parts In-Stock

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Overview

Experience seamless motion control with the TLE62086GXT by Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-notch quality and reliability in all their products. The TLE62086GXT falls under the Motion Control ICs category, offering unparalleled precision and efficiency. This versatile product is perfect for applications requiring high-performance Brush DC Motor Controllers. With its compact design and advanced BCDMOS technology, the TLE62086GXT provides customers with exceptional value, benefits, and advantages in their projects. Elevate your motion control systems with the TLE62086GXT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protection for the internal components, making this product a reliable choice.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into electronic designs, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact form factor, making it suitable for applications where space is limited.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V offers compatibility with a wide range of systems, increasing the versatility of this product.

No. of Terminals: 28

With 28 terminals, this IC provides ample connectivity options for various circuit configurations, making it a versatile solution for different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances the overall aesthetics of the product and allows for efficient use of board space.

Terminal Position: DUAL

Dual terminal positions offer flexibility in connection options, catering to different circuit layouts and requirements.

Maximum Seated Height: 2.65 mm

The low maximum seated height enables a slim profile for space-constrained applications, enhancing the product's usability in compact designs.

Width (mm): 7.6 mm

A width of 7.6mm provides a compact footprint, making this IC suitable for use in small electronic devices and systems.

Other IC type: BRUSH DC MOTOR CONTROLLER

With the additional feature of being a brush DC motor controller, this IC can efficiently drive and control DC motors, expanding its utility in motion control applications.

Technical Specifications

Motion Control ICs TLE62086GXT attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G28

Length:

18.1 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.6 mm

Trade Compliance

TLE62086GXT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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