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TLE62083GXUMA1

Infineon Technologies

TLE62083GXUMA1 by Infineon Technologies

BRUSH DC MOTOR CONTROLLER; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES; Minimum Supply Voltage (Vsup): 6.1 V;

Median Price

$1.906

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 2,500 parts In-Stock

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-

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2,500

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Rochester

USA . 535 parts In-Stock

1+ parts

-

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$1.800

1k+ parts

$1.610

10k+ parts

$1.510

535

-

$1.800

$1.610

$1.510

Verical

USA . 535 parts In-Stock

1+ parts

-

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$2.013

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$1.887

535

-

-

$2.013

$1.887

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Greenchips

USA . 337 parts In-Stock

1+ parts

$1.331

100+ parts

$1.268

1k+ parts

$1.208

10k+ parts

$1.090

337

$1.331

$1.268

$1.208

$1.090

Digiode

USA . 357 parts In-Stock

1+ parts

$1.900

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357

$1.900

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Chip Stock

USA . 16,000 parts In-Stock

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Vyrian

USA . 4,350 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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SIE Connect GmbH - GreenChips

Germany . 337 parts In-Stock

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337

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 864 parts In-Stock

1+ parts

$1.700

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864

$1.700

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Corphita

USA . 192 parts In-Stock

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$1.800

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192

$1.800

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AZTECH Wire

Italy . 1,012 parts In-Stock

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$10.770

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$10.770

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Modulus Dynamics

Lithuania . 43 parts In-Stock

1+ parts

$16.864

100+ parts

$16.189

1k+ parts

$15.515

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43

$16.864

$16.189

$15.515

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RC Electronics

USA . 31,679 parts In-Stock

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31,679

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A-Z Elektronik GmbH

Germany . 6,981 parts In-Stock

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6,981

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Perfect Parts

USA . 5,528 parts In-Stock

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5,528

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Microchip USA

USA . 355 parts In-Stock

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355

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iodParts Technologies Inc.

India . 180 parts In-Stock

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180

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Aranea Global

USA . 100 parts In-Stock

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100

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Technical Specifications

Motion Control ICs TLE62083GXUMA1 attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

Length:

8.75 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

6.1 V

Nominal Supply Voltage (Vsup):

13.2 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

4 mm

Trade Compliance

TLE62083GXUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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