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TLE4905LXA

Infineon Technologies

TLE4905LXA by Infineon Technologies

TLE4905LXA by Infineon Tech is a Hall effect magnetic field sensor with 24V max supply, 6mT hysteresis, and 8mA max operating current. Ideal for applications requiring digital current output sensing in plastic housing, such as automotive systems and industrial automation.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

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Vyrian

USA . 818 parts In-Stock

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Digiode

USA . 46 parts In-Stock

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Nova Conductors

Japan . 23 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,825 parts In-Stock

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$1.478

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Modulus Dynamics

Lithuania . 1,348 parts In-Stock

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$1.650

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$1.584

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$1.518

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Corohmni

South Africa . 613 parts In-Stock

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$1.686

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Ampacity Inc.

Singapore . 1,142 parts In-Stock

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$2.750

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AZTECH Wire

Italy . 361 parts In-Stock

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$15.201

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Argo Parts USA

USA . 4,124 parts In-Stock

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Continental Prestige Electronics

USA . 1,797 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Corphita

USA . 644 parts In-Stock

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Overview

Unlock limitless possibilities with the TLE4905LXA by Infineon Technologies. Crafted with precision and expertise, this magnetic field sensor offers unparalleled performance and reliability. Ideal for a wide range of applications, this sensor provides accurate and precise measurements with ease. Experience seamless integration and exceptional value with the TLE4905LXA, setting new standards in innovation and efficiency. Elevate your projects to new heights with this groundbreaking sensor from Infineon Technologies.

Feature Benefit Bullets

Maximum Supply Voltage: 24 V

Allows for a wide range of power options, ensuring compatibility with various systems.

Hysteresis: 6 mT

Provides accurate and precise reading of magnetic fields with minimal error margin.

Body Width: 1.52 inch

Compact size makes it suitable for applications with limited space availability.

Sensors or Transducers Type: MAGNETIC FIELD SENSOR,HALL EFFECT

Utilizes Hall effect technology for reliable and efficient magnetic field detection.

Package Shape or Style: RECTANGULAR

Easy to integrate into existing systems or circuit designs.

Minimum Supply Voltage: 3.8 V

Can operate effectively with low power sources, saving energy and reducing costs.

Output Type: DIGITAL CURRENT

Produces clear and easy-to-read digital current output for convenient data processing.

Maximum Operating Current: 8 mA

Efficiently draws minimal current during operation, reducing power consumption.

Housing: PLASTIC

Lightweight and durable housing material ensures longevity and ease of handling.

Body Length/Diameter: 4.16 mm

Provides a slim profile for versatile installation options in various setups.

Termination Type: SOLDER

Enables secure and reliable connection with other components or circuits.

Mounting Feature: THROUGH HOLE MOUNT

Facilitates easy and secure mounting onto circuit boards or other surfaces.

Technical Specifications

Magnetic Field Sensors TLE4905LXA attributes and parameters. Explore more Magnetic Field Sensors devices from Infineon Technologies

Specs

Body Width:

1.52 inch

Body Length/Diameter:

4.16 mm

Housing:

PLASTIC

Hysteresis:

6 mT

Mounting Feature:

Maximum Operating Current:

8 mA

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

24 V

Minimum Supply Voltage:

3.8 V

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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