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TLE49452LXA

Infineon Technologies

TLE49452LXA by Infineon Technologies

TLE49452LXA by Infineon is a Hall effect magnetic field sensor with 3.8V to 24V supply voltage range, 5mT hysteresis, and 8mA max operating current. It is used for digital current output applications in various industries due to its rectangular package style and through-hole mounting feature.

Median Price

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Lifecycle Status

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3

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1k+

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Digiode

USA . 687 parts In-Stock

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Vyrian

USA . 525 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Modulus Dynamics

Lithuania . 1,718 parts In-Stock

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$1.922

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$1.845

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$1.768

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Aztec Data Supply Inc.

USA . 2,952 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Corohmni

South Africa . 324 parts In-Stock

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Semicontronic

India . 1,081 parts In-Stock

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$7.750

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$7.518

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AZTECH Wire

Italy . 719 parts In-Stock

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$14.065

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Ampacity Inc.

Singapore . 1,146 parts In-Stock

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$15.750

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Continental Prestige Electronics

USA . 4,740 parts In-Stock

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Argo Parts USA

USA . 2,757 parts In-Stock

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Corphita

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Bastille Electronics

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Overview

Unlock the power of precise magnetic field sensing with the TLE49452LXA by Infineon Technologies. Manufactured by a trusted industry leader, this sensor offers unparalleled quality and reliability. Ideal for a wide range of applications, from automotive to industrial control systems, this sensor provides accurate measurements with a maximum supply voltage of 24 V and hysteresis of 5 mT. With its compact design and digital output, the TLE49452LXA delivers exceptional value, making it the top choice for customers seeking high-performance sensing solutions.

Feature Benefit Bullets

Maximum Supply Voltage: 24 V

The high maximum supply voltage allows for flexibility in power supply options and can handle higher voltage applications.

Hysteresis: 5 mT

The low hysteresis value ensures accurate and precise measurement of magnetic fields, making the sensor reliable for various applications.

Body Width: 1.52 inch

The compact body width allows for easy integration and installation in tight spaces or on small devices.

Sensors or Transducers Type: MAGNETIC FIELD SENSOR, HALL EFFECT

The Hall Effect sensor type provides accurate and reliable measurement of magnetic fields, making it suitable for a wide range of industrial and scientific applications.

Package Shape or Style: RECTANGULAR

The rectangular package shape makes the sensor easy to mount and align in various orientations, improving flexibility in installation.

Minimum Supply Voltage: 3.8 V

The low minimum supply voltage ensures energy efficiency and can operate in low power applications without compromising performance.

Output Type: DIGITAL CURRENT

The digital current output provides a simple and easy-to-read signal, making it compatible with digital systems and easier to integrate into existing circuits.

Maximum Operating Current: 8 mA

The low maximum operating current ensures energy efficiency and reduces power consumption, making it suitable for battery-operated devices.

Housing: PLASTIC

The plastic housing is lightweight, durable, and cost-effective, making the sensor suitable for both indoor and outdoor applications.

Body Length/Diameter: 4.16 mm

The small body length/diameter allows for easy integration and discreet placement of the sensor in compact devices or equipment.

Termination Type: SOLDER

The solder termination type provides a secure and reliable connection, ensuring stable performance even in harsh operating conditions.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature allows for easy and secure installation on circuit boards or surfaces, providing stability and reliability in operation.

Technical Specifications

Magnetic Field Sensors TLE49452LXA attributes and parameters. Explore more Magnetic Field Sensors devices from Infineon Technologies

Specs

Body Width:

1.52 inch

Body Length/Diameter:

4.16 mm

Housing:

PLASTIC

Hysteresis:

5 mT

Mounting Feature:

Maximum Operating Current:

8 mA

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

24 V

Minimum Supply Voltage:

3.8 V

Termination Type:

SOLDER

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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