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TLE49642MXTSA1/SAMPLE

Infineon Technologies

TLE49642MXTSA1/SAMPLE by Infineon Technologies

TLE49642MXTSA1/SAMPLE by Infineon Technologies is a magnetic field sensor with a max supply voltage of 32V and hysteresis of 5.5mT. It has a current output range of 0-25mA and is commonly used in applications such as automotive systems, industrial automation, and robotics.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Nova Conductors

Japan . 500 parts In-Stock

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Digiode

USA . 442 parts In-Stock

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Vyrian

USA . 357 parts In-Stock

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Modulus Dynamics

Lithuania . 1,993 parts In-Stock

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$1.559

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$1.497

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$1.434

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Aztec Data Supply Inc.

USA . 4,375 parts In-Stock

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$1.950

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Corohmni

South Africa . 90 parts In-Stock

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Semicontronic

India . 743 parts In-Stock

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$2.750

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$2.681

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$2.668

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743

$2.750

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AZTECH Wire

Italy . 264 parts In-Stock

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$11.765

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Ampacity Inc.

Singapore . 429 parts In-Stock

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$17.750

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Continental Prestige Electronics

USA . 2,496 parts In-Stock

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Argo Parts USA

USA . 1,081 parts In-Stock

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Corphita

USA . 768 parts In-Stock

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Bastille Electronics

Australia . 99 parts In-Stock

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Overview

Discover the TLE49642MXTSA1/SAMPLE by Infineon Technologies, a high-quality Magnetic Field Sensor that offers unparalleled performance and reliability. Manufactured by Infineon Technologies, a leader in semiconductor solutions, this sensor is perfect for a wide range of applications. With a maximum supply voltage of 32V and a minimum operating temperature of -40°C, it guarantees optimal functionality in any environment. Offering a current output range of 0-25mA, this sensor provides accurate and precise measurements. Its compact size and surface mounting feature make it easy to integrate into any design. Trust the TLE49642MXTSA1/SAMPLE to deliver exceptional value, benefits, and advantages to meet all your magnetic field sensing needs.

Feature Benefit Bullets

Maximum Supply Voltage: 32V

A high maximum supply voltage allows for a wide range of applications and ensures compatibility with various power sources.

Hysteresis: 5.5mT

The low hysteresis value ensures accurate and stable measurements, making this magnetic field sensor ideal for precise industrial and scientific applications.

Body Width: 1.3 inch

The compact body width enables easy integration and installation in limited space environments without sacrificing performance.

Sensors or Transducers Type: MAGNETIC FIELD SENSOR, HALL EFFECT

Being a Hall effect sensor, this product provides contactless sensing capabilities, ensuring reliability and durability, making it suitable for harsh environments.

Body Height: 1mm

The ultra-thin body height allows for non-intrusive and space-saving installation, making this sensor suitable for applications where size and weight are critical factors.

Package Shape or Style: RECTANGULAR

The rectangular package shape enables the magnetic field sensor to be easily mounted and secured, simplifying the assembly process.

Minimum Supply Voltage: 3V

With a low minimum supply voltage, this sensor is energy-efficient and can operate in low-power applications while maintaining accurate readings.

Maximum Operating Temperature: 170 °C

The high maximum operating temperature allows this sensor to withstand demanding environments without compromising its performance, making it suitable for industrial applications.

Output Range: 0-25mA

The wide output range provides versatility in measuring magnetic field strength, offering precise readings across a broad range of intensities.

Output Type: CURRENT OUTPUT

With a current output, this sensor simplifies integration into existing systems, allowing for direct compatibility without the need for additional signal conditioning.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the sensor's reliable performance in extreme cold conditions, making it suitable for a wide range of environments.

Maximum Operating Current: 2.5mA

With a low maximum operating current, this sensor minimizes power consumption, making it energy-efficient and suitable for battery-powered applications.

Housing: PLASTIC

The plastic housing provides durability and resistance to environmental factors, ensuring the sensor's longevity and reliability in diverse applications.

Minimum Range Of Magnetic Field: 15.9 mT

With a low minimum range of magnetic field detection, this sensor is capable of detecting subtle changes, making it suitable for highly sensitive applications.

Maximum Output Current: 25A

The high maximum output current facilitates compatibility with a wide range of systems and simplifies integration into higher current circuits or devices.

Maximum Magnetic Field Range: 36 mT

With a high maximum magnetic field range, this sensor is suitable for applications that require measuring a broad spectrum of magnetic field strengths.

Body Length/Diameter: 2.9mm

The compact body length allows for easy integration into space-constrained environments while maintaining performance and accuracy.

Termination Type: SOLDER

The solder termination type ensures reliable electrical connections and straightforward installation, guaranteeing the sensor's functionality and stability.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies the integration process, making it suitable for automated assembly and reducing production time and costs.

Technical Specifications

Magnetic Field Sensors TLE49642MXTSA1/SAMPLE attributes and parameters. Explore more Magnetic Field Sensors devices from Infineon Technologies

Specs

Additional Features:

REVERSE POLARITY PROTECTION

Body Width:

1.3 inch

Body Height:

1 mm

Body Length/Diameter:

2.9 mm

Housing:

PLASTIC

Hysteresis:

5.5 mT

Maximum Magnetic Field Range:

36 mT

Minimum Range Of Magnetic Field:

15.9 mT

Mounting Feature:

Maximum Operating Current:

2.5 mA

Maximum Operating Temperature:

170 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

25 A

Output Range:

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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