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TLE42502GXT

Infineon Technologies

TLE42502GXT by Infineon Technologies

TLE42502GXT by Infineon Technologies is a Power Management IC with a Nominal Voltage of 13.5V, suitable for POWER SUPPLY SUPPORT CIRCUITS. It features a SMALL OUTLINE, THIN PROFILE package style and an Adjustable Threshold with a Max Supply Voltage of 40V. Ideal for applications requiring precise power management in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 185,613 parts In-Stock

1+ parts

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185,613

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Digiode

USA . 513 parts In-Stock

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513

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 176,737 parts In-Stock

1+ parts

$0.239

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176,737

$0.239

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Semicontronic

India . 176,614 parts In-Stock

1+ parts

$0.239

100+ parts

$0.233

1k+ parts

$0.232

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176,614

$0.239

$0.233

$0.232

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Corohmni

South Africa . 52 parts In-Stock

1+ parts

$11.539

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52

$11.539

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Aztec Data Supply Inc.

USA . 2,379 parts In-Stock

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$12.417

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2,379

$12.417

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AZTECH Wire

Italy . 647 parts In-Stock

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$14.878

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647

$14.878

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Modulus Dynamics

Lithuania . 5,625 parts In-Stock

1+ parts

$18.461

100+ parts

$17.723

1k+ parts

$16.984

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5,625

$18.461

$17.723

$16.984

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Continental Prestige Electronics

USA . 5,254 parts In-Stock

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5,254

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Argo Parts USA

USA . 2,640 parts In-Stock

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2,640

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Advanced Electronics

New Zealand . 700 parts In-Stock

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700

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Corphita

USA . 450 parts In-Stock

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450

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Robosynatics

Brazil . 200 parts In-Stock

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$193.975

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$193.975

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$193.975

200

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$193.975

$193.975

$193.975

Lucentia Tech

USA . 200 parts In-Stock

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$193.975

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$193.975

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$193.975

200

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$193.975

$193.975

$193.975

Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Elevate your power management solutions with the TLE42502GXT by Infineon Technologies. Known for their exceptional quality and innovation, Infineon Technologies delivers top-of-the-line Power Management ICs that cater to a wide range of applications. With a compact design and adjustable threshold, this product offers unmatched versatility and performance. Experience reliable and efficient power supply support like never before with the TLE42502GXT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and mechanical protection for the IC, ensuring reliability and durability.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the PCB.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easy to handle during assembly.

Nominal Supply Voltage (Vsup): 13.5 V

Suitable for a wide range of applications with a stable supply voltage.

No. of Terminals: 5

Optimal number of terminals for connecting to different components in the system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

Compact design with a thin profile helps in saving space in the system.

Terminal Position: DUAL

Dual terminal position provides better stability and connectivity.

Maximum Seated Height: 1.1 mm

Low profile design allows for installation in slim devices or tight spaces.

Width (mm): 1.6 mm

Narrow width enables close placement of components for efficient circuit design.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed for power supply support, ensuring reliable and efficient power management.

Minimum Supply Voltage (Vsup): 4 V

Supports a wide range of supply voltages, making it versatile for different applications.

Length: 2.9 mm

Compact length allows for flexibility in PCB layout and space-constrained designs.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and easy soldering onto the PCB.

Terminal Pitch: 0.95 mm

Close terminal pitch allows for compact layout and efficient use of PCB space.

Maximum Supply Voltage (Vsup): 40 V

Can handle high supply voltages, making it suitable for a wide range of applications.

Adjustable Threshold: YES

Ability to adjust the threshold level provides customization and flexibility in power management settings.

Technical Specifications

Power Management ICs TLE42502GXT attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G5

Length:

2.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

13.5 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width (mm):

1.6 mm

Trade Compliance

TLE42502GXT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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