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TLE4251DXT

Infineon Technologies

TLE4251DXT by Infineon Technologies

TLE4251DXT by Infineon Technologies is a Power Management IC with a nominal voltage of 13.5V and adjustable threshold feature. It comes in a small outline rectangular package with gull wing terminals, suitable for power supply support circuits. With a terminal pitch of 1.14mm and max supply voltage of 40V, it offers versatile applications in various electronic devices.

Median Price

$0.999

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 15,000 parts In-Stock

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$0.999

15,000

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$0.999

Distributors (In-Stock)

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Vyrian

USA . 14,567 parts In-Stock

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14,567

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NexGen Digital

USA . 2,244 parts In-Stock

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2,244

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Digiode

USA . 36 parts In-Stock

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36

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 14,626 parts In-Stock

1+ parts

$0.850

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-

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14,626

$0.850

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Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$3.571

100+ parts

$3.250

1k+ parts

$2.928

10k+ parts

-

270

$3.571

$3.250

$2.928

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Corohmni

South Africa . 516 parts In-Stock

1+ parts

$9.968

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516

$9.968

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Aztec Data Supply Inc.

USA . 30,821 parts In-Stock

1+ parts

$14.010

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30,821

$14.010

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Modulus Dynamics

Lithuania . 3,543 parts In-Stock

1+ parts

$20.881

100+ parts

$20.046

1k+ parts

$19.211

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3,543

$20.881

$20.046

$19.211

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Continental Prestige Electronics

USA . 6,375 parts In-Stock

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6,375

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Argo Parts USA

USA . 4,359 parts In-Stock

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4,359

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Corphita

USA . 62 parts In-Stock

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62

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Infineon Automotive Solutions are a comprehensive and reliable portfolio of products for automotive and other applications. Infineon has 40 years of experience developing and producing products to meet automotive market demands. These technologies are used to design and produce a large number of power products to meet all automotive, transportation, lighting and motor-drive industry requirements. These products are automotive qualified (AEC-Q100 or AEC-Q101) and available for current and future electronic system designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, reducing overall product weight and ensuring long-lasting performance.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 13.5 V

Operating at a nominal supply voltage of 13.5V provides a stable power source for the device, ensuring reliable performance under normal operating conditions.

No. of Terminals: 5

Having 5 terminals allows for efficient connection to the circuit, making it easier to integrate the power management IC into the overall system.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs and applications where board space is limited.

Maximum Seated Height: 2.5 mm

With a maximum seated height of 2.5mm, this power management IC can be easily accommodated in thin devices or applications with height restrictions.

Width (mm): 6.22 mm

The narrow width of 6.22mm ensures that the IC can fit into tight spaces without compromising on functionality or performance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit IC, it provides essential functions to ensure stable and reliable power delivery to the system, enhancing overall performance.

Minimum Supply Voltage (Vsup): 4 V

A minimum supply voltage of 4V allows for flexibility in power source options, making the IC versatile and suitable for a range of applications.

Length: 6.5 mm

The compact length of 6.5mm further contributes to the space-saving design of the power management IC, making it ideal for compact and portable devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto the PCB, ensuring secure connections and reliable operation of the power management IC.

Terminal Pitch: 1.14 mm

A terminal pitch of 1.14mm provides sufficient spacing between terminals for easy soldering and reduces the risk of short circuits during assembly.

Maximum Supply Voltage (Vsup): 40 V

The high maximum supply voltage of 40V ensures compatibility with a wide range of power sources, making the IC suitable for diverse applications.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization of voltage levels, enabling the IC to meet specific system requirements and optimize performance.

Technical Specifications

Power Management ICs TLE4251DXT attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PSSO-G5

Length:

6.5 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.5 mm

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

13.5 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

1.14 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

6.22 mm

Trade Compliance

TLE4251DXT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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