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TLE4251DNT

Infineon Technologies

TLE4251DNT by Infineon Technologies

TLE4251DNT by Infineon Technologies is a Power Management IC with a nominal voltage of 13.5V, adjustable threshold, and max supply voltage of 40V. It is used in power supply support circuits for various applications due to its small outline package style and gull wing terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,080 parts In-Stock

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1,080

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Digiode

USA . 303 parts In-Stock

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303

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Ampacity Inc.

Singapore . 742 parts In-Stock

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$3.500

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742

$3.500

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AZTECH Wire

Italy . 553 parts In-Stock

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$4.984

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553

$4.984

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Modulus Dynamics

Lithuania . 4,889 parts In-Stock

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$21.994

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$21.114

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$20.234

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4,889

$21.994

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$20.234

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Andel Nordic

Denmark . 430 parts In-Stock

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$23.410

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$16.387

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$16.387

430

$23.410

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$16.387

$16.387

Continental Prestige Electronics

USA . 6,590 parts In-Stock

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6,590

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Argo Parts USA

USA . 4,875 parts In-Stock

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Corphita

USA . 231 parts In-Stock

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Bastille Electronics

Australia . 85 parts In-Stock

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Overview

Experience the next level of power management with the TLE4251DNT from Infineon Technologies. Known for their superior quality and reliability, Infineon offers a wide range of applications in the Power Management ICs category. The TLE4251DNT, with its compact size and adjustable threshold, provides unmatched value and benefits to customers looking for efficient and reliable power supply support circuits. Trust Infineon to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Nominal Supply Voltage (Vsup): 13.5 V

The nominal supply voltage of 13.5V ensures stable and reliable power supply to the connected devices.

No. of Terminals: 5

The 5 terminals provide sufficient connectivity options for different components in the circuit, offering flexibility in design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices.

Minimum Supply Voltage (Vsup): 4 V

The minimum supply voltage of 4V ensures compatibility with a wide range of power sources, increasing versatility.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and secure connections to the circuit board, enhancing the overall reliability of the product.

Maximum Supply Voltage (Vsup): 40 V

The maximum supply voltage of 40V ensures the product can handle higher voltage inputs, offering protection against power surges or fluctuations.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization of the circuit's operating parameters, providing flexibility in various applications.

Technical Specifications

Power Management ICs TLE4251DNT attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PSSO-G5

Length:

6.5 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.5 mm

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

13.5 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

1.14 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

6.22 mm

Trade Compliance

TLE4251DNT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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