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SPB20N60C3

Infineon Technologies

SPB20N60C3 by Infineon Technologies

SPB20N60C3 by Infineon is a N-CHANNEL FET with 600V DS Breakdown Voltage, 62.1A IDM, and 0.19 ohm RDS(on). Widely used in power applications due to its 208W Pdiss, EAS of 690mJ, and -55 to 150°C operating range. Ideal for high-power systems requiring efficient switching capabilities.

Median Price

$4.340

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 1,709 parts In-Stock

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$4.340

100+ parts

$2.020

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$1.660

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1,709

$4.340

$2.020

$1.660

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Distributors (In-Stock)

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Digiode

USA . 571 parts In-Stock

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$3.848

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571

$3.848

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TME

Poland . 752 parts In-Stock

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$3.900

100+ parts

$2.890

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$2.690

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752

$3.900

$2.890

$2.690

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Vyrian

USA . 151 parts In-Stock

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$4.050

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151

$4.050

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ComSIT Distribution GmbH

Germany . 1,241 parts In-Stock

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Rutronik

Germany . 1,000 parts In-Stock

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$2.490

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$1.920

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$2.490

$1.920

LIBRA Elektronik GmbH

Germany . 805 parts In-Stock

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805

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Cyclops Electronics Ltd

UK . 708 parts In-Stock

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Sensible Micro Corp

USA . 214 parts In-Stock

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LWI Electronics Inc

India . 32 parts In-Stock

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Odintec Ltd.

Israel . 20 parts In-Stock

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Ashlea Components Ltd

UK . 8 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 4 parts In-Stock

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Modulus Dynamics

Lithuania . 20,397 parts In-Stock

1+ parts

$1.936

100+ parts

$1.859

1k+ parts

$1.781

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20,397

$1.936

$1.859

$1.781

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Corphita

USA . 344 parts In-Stock

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$3.645

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Kepictronics

USA . 27,860 parts In-Stock

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Perfect Parts

USA . 18,498 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

Germany . 12,740 parts In-Stock

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12,740

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Overview

Unleash the power of innovation with the SPB20N60C3 by Infineon Technologies. This high-quality Power Field Effect Transistor (FET) offers unmatched performance and reliability, making it the ideal choice for a wide range of applications. With its N-CHANNEL design and built-in diode, this transistor delivers exceptional efficiency and durability. Whether you're in need of enhanced power management or improved circuit protection, the SPB20N60C3 is the perfect solution. Trust in Infineon Technologies to bring you cutting-edge technology that exceeds expectations. Elevate your projects with the SPB20N60C3 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for applications where weight and robustness are important factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-state resistance and higher efficiency compared to P-channel FETs, making them suitable for high-performance power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from potential damage due to reverse current flow, improving reliability and efficiency.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage of 600 V ensures reliable operation in high voltage applications, making it suitable for power distribution and industrial equipment.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Pulsed Drain Current (IDM): 62.1 A

The high pulsed drain current rating indicates the FET's ability to handle short duration high-current pulses, making it suitable for power electronics applications with varying load conditions.

Maximum Power Dissipation (Abs): 208 W

With a high power dissipation capability of 208 W, this FET can efficiently handle high power levels without overheating, ensuring reliable performance in demanding applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows the FET to operate reliably in high-temperature environments, making it suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) SPB20N60C3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

690 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

20.7 A

Maximum Drain Current (ID):

20.7 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

62.1 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

SPB20N60C3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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