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SPB21N50C3

Infineon Technologies

SPB21N50C3 by Infineon Technologies

Infineon's SPB21N50C3 is a N-CHANNEL FET with 500V DS breakdown voltage, ideal for switching applications. Features include 63A IDM, 690mJ EAS, and 0.19 ohm RDS(on). With a max power dissipation of 208W and operating temperature up to 150°C, it's suitable for high-power environments.

Median Price

$3.220

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,452 parts In-Stock

1+ parts

$3.220

100+ parts

$1.990

1k+ parts

$1.710

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1,452

$3.220

$1.990

$1.710

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Distributors (In-Stock)

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Digiode

USA . 643 parts In-Stock

1+ parts

$4.038

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-

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643

$4.038

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Vyrian

USA . 344 parts In-Stock

1+ parts

$4.250

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344

$4.250

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LIBRA Elektronik GmbH

Germany . 440 parts In-Stock

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440

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ComSIT Distribution GmbH

Germany . 30 parts In-Stock

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30

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 741 parts In-Stock

1+ parts

$0.383

100+ parts

$0.368

1k+ parts

$0.352

10k+ parts

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741

$0.383

$0.368

$0.352

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Corphita

USA . 863 parts In-Stock

1+ parts

$3.825

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863

$3.825

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Andel Nordic

Denmark . 2,427 parts In-Stock

1+ parts

$16.410

100+ parts

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$11.489

10k+ parts

$11.489

2,427

$16.410

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$11.489

$11.489

Perfect Parts

USA . 17,391 parts In-Stock

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17,391

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Lixinc

USA . 17,118 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,629 parts In-Stock

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8,629

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kepictronics

USA . 442 parts In-Stock

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442

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Overview

Infineon's CoolMOS™ CE Power MOSFETs are a technology platform of high voltage power MOSFETs that are designed according to the super junction principle (SJ) and conceived to fulfill consumer requirements. CoolMOS™ CE portfolio offers 500V, 600V, 650V, 700V, and 800V devices targeting low power chargers for mobile devices and power tools, adapters for notebook and laptops, LCD, LED TV and LED lighting. This new series of CoolMOS™ is cost-optimized to meet typical requirements in consumers with no compromise on proven CoolMOS™ quality and reliability while still being price attractive.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to environmental factors, ensuring the longevity of the product.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON-state resistance and higher efficiency compared to P-Channel FETs, making them ideal for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures reliable performance and efficient power management.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this FET can withstand high temperature environments, providing reliable performance in a variety of conditions.

Maximum Power Dissipation (Abs): 208 W

The high maximum power dissipation of 208 W allows this FET to handle high power levels without overheating, making it suitable for demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) SPB21N50C3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH VOLTAGE

Avalanche Energy Rating (EAS):

690 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

21 A

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

63 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPB21N50C3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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