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SPA21N50C3XKSA1

Infineon Technologies

SPA21N50C3XKSA1 by Infineon Technologies

SPA21N50C3XKSA1 by Infineon Technologies is a N-CHANNEL FET with 500V DS Breakdown Voltage, ideal for SWITCHING applications. It features 63A IDM, 690mJ EAS, and 0.19 ohm RDS(ON). The transistor operates in ENHANCEMENT MODE at up to 150°C, making it suitable for high-power systems.

Median Price

$2.487

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 424 parts In-Stock

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$2.169

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$2.169

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Chip1Stop

Japan . 494 parts In-Stock

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$2.790

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494

$2.790

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Rochester

USA . 1,592 parts In-Stock

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$2.220

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$1.990

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$1.870

1,592

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$2.220

$1.990

$1.870

DigiKey

USA . 1,465 parts In-Stock

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$2.930

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1,465

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$2.930

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Verical

USA . 950 parts In-Stock

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$2.487

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$2.337

950

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$2.487

$2.337

Distributors (In-Stock)

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Digiode

USA . 948 parts In-Stock

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$2.061

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Vyrian

USA . 951 parts In-Stock

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Bristol Electronics

USA . 149 parts In-Stock

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$1.787

1k+ parts

$1.659

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149

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$1.787

$1.659

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Dan-Mar Components

USA . 149 parts In-Stock

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Nova Conductors

Japan . 93 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 490 parts In-Stock

1+ parts

$0.567

100+ parts

$0.544

1k+ parts

$0.522

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490

$0.567

$0.544

$0.522

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Corohmni

South Africa . 992 parts In-Stock

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$1.030

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992

$1.030

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Aztec Data Supply Inc.

USA . 978 parts In-Stock

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$1.180

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$1.180

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Ampacity Inc.

Singapore . 1,049 parts In-Stock

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$1.840

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$1.840

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Semicontronic

India . 1,009 parts In-Stock

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$1.840

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$1.794

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$1.785

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$1.840

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Corphita

USA . 575 parts In-Stock

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$1.952

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Continental Prestige Electronics

USA . 453 parts In-Stock

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$2.820

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$2.710

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453

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Microchip USA

USA . 8,050 parts In-Stock

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$15.410

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$15.310

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$15.260

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$15.220

8,050

$15.410

$15.310

$15.260

$15.220

Argo Parts USA

USA . 4,905 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 700 parts In-Stock

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700

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Discover the SPA21N50C3XKSA1 from Infineon Technologies, a top-tier manufacturer in the Power Field Effect Transistors (FET) category. With a minimum DS Breakdown Voltage of 500V and a maximum Drain Current of 21A, this N-CHANNEL transistor is perfect for switching applications. Its single configuration with a built-in diode ensures efficiency and reliability. Experience enhanced performance and durability with this transistor's metal-oxide semiconductor technology. Elevate your projects with the SPA21N50C3XKSA1 and enjoy seamless operation at up to 150°C. Experience the difference that quality and innovation can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good insulation properties, making the transistor more reliable and durable in a variety of operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and are more efficient than P-channel FETs, making them a preferred choice for many switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the circuit from reverse voltage spikes, enhancing the reliability and robustness of the transistor.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control power flow in electronic circuits, making it suitable for a wide range of devices and systems.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage, this FET can handle high voltage applications without the risk of damaging the transistor or the circuit it is connected to.

Maximum Pulsed Drain Current (IDM): 63 A

The high pulsed drain current rating allows this FET to handle sudden spikes in current without overheating, ensuring reliable performance in demanding situations.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without compromising its performance, making it suitable for applications where heat dissipation is critical.

Technical Specifications

Power Field Effect Transistors (FET) SPA21N50C3XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

690 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

63 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPA21N50C3XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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