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SIDC73D170E6X1SA2

Infineon Technologies

SIDC73D170E6X1SA2 by Infineon Technologies

Infineon's SIDC73D170E6X1SA2 is a single rectifier diode with 1700V peak reverse voltage and 100A output current. Its square, surface-mount package makes it ideal for high-power applications in a wide temperature range from -40°C to 175°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,504 parts In-Stock

1+ parts

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1,504

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Digiode

USA . 172 parts In-Stock

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172

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 4,125 parts In-Stock

1+ parts

$0.120

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4,125

$0.120

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Semicontronic

India . 1,360 parts In-Stock

1+ parts

$2.010

100+ parts

$1.960

1k+ parts

$1.950

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1,360

$2.010

$1.960

$1.950

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Ampacity Inc.

Singapore . 220 parts In-Stock

1+ parts

$2.010

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220

$2.010

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Modulus Dynamics

Lithuania . 28,352 parts In-Stock

1+ parts

$11.530

100+ parts

$11.069

1k+ parts

$10.608

10k+ parts

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28,352

$11.530

$11.069

$10.608

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Corohmni

South Africa . 796 parts In-Stock

1+ parts

$11.530

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796

$11.530

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$11.876

100+ parts

$11.282

1k+ parts

$11.282

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1,000

$11.876

$11.282

$11.282

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AZTECH Wire

Italy . 680 parts In-Stock

1+ parts

$17.741

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680

$17.741

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Microchip USA

USA . 4,691 parts In-Stock

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4,691

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Continental Prestige Electronics

USA . 4,024 parts In-Stock

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4,024

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Argo Parts USA

USA . 3,182 parts In-Stock

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3,182

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Corphita

USA . 227 parts In-Stock

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227

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock a world of possibilities with the SIDC73D170E6X1SA2 by Infineon Technologies. This high-quality rectifier diode offers unmatched reliability and performance, making it ideal for a wide range of applications. From power supplies to industrial automation, this diode ensures smooth operation and efficient power management. Trust in the expertise and reputation of Infineon Technologies to deliver top-notch solutions for your electronic needs. Elevate your projects with the SIDC73D170E6X1SA2 and experience the difference in quality and efficiency.

Feature Benefit Bullets

Config: SINGLE

Single configuration makes it easy to use and simplifies the installation process.

Surface Mount: YES

Surface mount capability allows for easy and convenient mounting on circuit boards.

Package Shape: SQUARE

Square package shape provides stability and ease of handling during installation.

Package Style (Meter): UNCASED CHIP

Uncased chip package style allows for a compact design and efficient heat dissipation.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures reliability even in demanding environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in a wide range of temperature conditions.

Terminal Position: UPPER

Upper terminal position makes it easy to connect and integrate into circuits.

Diode Type: RECTIFIER DIODE

Rectifier diode type ensures efficient conversion of AC to DC power.

Maximum Output Current: 100 A

High maximum output current capability allows for handling of large power loads.

Terminal Form: NO LEAD

No lead terminal form simplifies the design and installation process.

Maximum Repetitive Peak Reverse Voltage: 1700 V

High maximum repetitive peak reverse voltage protects against voltage surges and spikes.

Diode Element Material: SILICON

Silicon diode element material offers high efficiency and reliability in power conversion applications.

Technical Specifications

Diodes & Rectifiers SIDC73D170E6X1SA2 attributes and parameters. Explore more Diodes & Rectifiers devices from Infineon Technologies

Specs

Application:

GENERAL PURPOSE

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

JESD-30 Code:

S-XUUC-N1

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

1

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

100 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

1700 V

Surface Mount:

YES

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SIDC73D170E6X1SA2 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.40

SB

8541.10.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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