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SFH3100F

Infineon Technologies

SFH3100F by Infineon Technologies

SFH3100F by Infineon Technologies is a phototransistor with a peak wavelength of 920nm. It has a max operating temperature of 85°C and a min operating temperature of -40°C. This through-hole mount device is commonly used in applications requiring low dark current and a max on-state current of 0.05A.

Median Price

$0.290

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Avnet

USA . 6,429 parts In-Stock

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Farnell

UK . 1,945 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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TME

Poland . 1,817 parts In-Stock

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$0.249

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Vyrian

USA . 7,339 parts In-Stock

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Inventory MP

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Bristol Electronics

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Prism Electronics

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Digiode

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Fibra_Brandt Electronic GMBH

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Netroflash

USA . 500 parts In-Stock

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$0.324

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$0.318

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$0.308

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$0.301

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$0.324

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Modulus Dynamics

Lithuania . 5,086 parts In-Stock

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$0.405

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$0.389

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$0.373

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Ampacity Inc.

Singapore . 637 parts In-Stock

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AZTECH Wire

Italy . 874 parts In-Stock

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Perfect Parts

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Corphita

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Overview

Discover a world of endless possibilities with the SFH3100F phototransistor by Infineon Technologies. Renowned for their commitment to quality and innovation, Infineon Technologies brings you a product that exceeds expectations. The SFH3100F boasts a peak wavelength of 920nm, making it the ideal choice for a wide range of applications. From industrial automation to automotive safety systems, this phototransistor delivers unparalleled performance. With its robust construction and reliable operation even in extreme temperatures (-40°C to 85°C), the SFH3100F ensures longevity and durability. Trust Infineon Technologies to provide you with cutting-edge technology that enhances your products and drives your success.

Feature Benefit Bullets

Peak Wavelength (nm)

The phototransistors can handle high on-state currents of up to 0.05A, enabling them to reliably switch or control higher power loads. This feature provides customers with the flexibility to use these components in applications that require higher current capacities, expanding their range of potential uses and enhancing the overall versatility of the product.

Technical Specifications

Phototransistors SFH3100F attributes and parameters. Explore more Phototransistors devices from Infineon Technologies

Specs

Maximum Dark Current:

50 nA

JESD-609 Code:

e0

Mounting Feature:

Maximum On State Current:

.05 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Peak Wavelength (nm):

920

Sub-Category:

Photo Transistors

Terminal Finish:

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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