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SAK-C505CA-4EMCA/TR

Infineon Technologies

SAK-C505CA-4EMCA/TR by Infineon Technologies

SAK-C505CA-4EMCA/TR by Infineon is an 8051 microcontroller with 8-bit data RAM and 16-bit address bus. It features 3 timers, 6 external interrupts, and ADC with 8 channels for applications requiring CAN and USART connectivity. Operating at up to 20 MHz, it offers low power mode and PWM support in a compact flatpack package.

Median Price

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3

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< 1k

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Digiode

USA . 380 parts In-Stock

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Vyrian

USA . 357 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 352 parts In-Stock

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$5.741

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Ampacity Inc.

Singapore . 299 parts In-Stock

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$13.000

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Modulus Dynamics

Lithuania . 1,614 parts In-Stock

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$38.400

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$36.864

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$35.328

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Andel Nordic

Denmark . 3,554 parts In-Stock

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$47.290

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$33.104

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$33.104

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$33.104

Aztec Data Supply Inc.

USA . 978 parts In-Stock

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$75.620

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Continental Prestige Electronics

USA . 4,902 parts In-Stock

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Bastille Electronics

Australia . 3,595 parts In-Stock

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Argo Parts USA

USA . 1,275 parts In-Stock

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Corphita

USA . 537 parts In-Stock

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Corohmni

South Africa . 288 parts In-Stock

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Overview

Elevate your project with the SAK-C505CA-4EMCA/TR microcontroller from Infineon Technologies, a leader in cutting-edge technology. Designed for versatility and reliability, this compact device offers a wide range of applications across various industries. With its high-quality manufacturing and innovative features, customers can expect superior performance and seamless integration into their projects. Experience the value and benefits of Infineon's microcontroller today and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package provides durability and protection for the microcontroller, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 5.5 V

Ability to handle a maximum supply voltage of 5.5V provides flexibility in power supply options, accommodating a wide range of applications.

On Chip Data RAM Width: 8

8-bit data RAM width enables efficient data processing and storage, enhancing the microcontroller's overall performance.

Address Bus Width: 16

16-bit address bus width allows for efficient memory addressing and management, facilitating complex computing tasks.

Package Style (Meter): FLATPACK

Flatpack package style offers a compact and space-saving design, making it suitable for applications with limited board space.

No. of Terminals: 44

44 terminals provide ample connectivity options for peripherals and external devices, enhancing the microcontroller's versatility.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product is specifically designed for embedded systems, offering integrated peripherals and processing capabilities in a single chip.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency of 20 MHz enables fast and efficient operation, suitable for applications requiring real-time processing or high-speed data handling.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy efficient and reliable in noisy environments.

Technical Specifications

Microcontrollers SAK-C505CA-4EMCA/TR attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

IT CAN ALSO OPERATE AT 2V MINIMUM SUPPLY @ POWER DOWN MODE

Address Bus Width:

16

Bit Size:

8

Boundary Scan:

NO

CPU Family:

8051

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

Low Power Mode:

YES

No. of External Interrupts:

6

No. of I/O Lines:

34

No. of Serial I/Os:

2

No. of Terminals:

44

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.52SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

RAM Bytes:

1280

ROM Words:

32768

ROM Programmability:

OTPROM

Maximum Seated Height:

2.45 mm

Speed:

20 rpm

Maximum Supply Current:

37.6 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.25 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, USART

Peripherals:

TIMER(6), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

SAK-C505CA-4EMCA/TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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