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SAK-C167CS-L40M

Infineon Technologies

SAK-C167CS-L40M by Infineon Technologies

SAK-C167CS-L40M by Infineon: 16-bit microcontroller with 24-bit address bus, 5V supply, and 50MHz clock freq. Ideal for automotive applications due to -40 to 125 °C operating temp range. Features ADC channels, PWM support, and 3072 bytes of RAM for versatile system integration.

Median Price

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Lifecycle Status

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5

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1k+

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Digiode

USA . 823 parts In-Stock

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Nova Conductors

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Fibra_Brandt Electronic GMBH

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ComSIT Distribution GmbH

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Ampacity Inc.

Singapore . 506 parts In-Stock

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Andel Nordic

Denmark . 3,140 parts In-Stock

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Modulus Dynamics

Lithuania . 1,621 parts In-Stock

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$38.307

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Argo Parts USA

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Overview

Unlock the power of innovative technology with the SAK-C167CS-L40M microcontroller by Infineon Technologies. Designed with precision and reliability in mind, this product offers unparalleled performance for a wide range of applications. From automotive to industrial automation, this microcontroller delivers seamless functionality and efficiency. Experience the value of cutting-edge technology with the SAK-C167CS-L40M and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient assembly onto PCBs, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Address Bus Width: 24

Allows for larger memory addressing capabilities, accommodating more complex programs.

Package Shape: SQUARE

Optimizes space utilization on the PCB, suitable for compact design requirements.

Bit Size: 16

Offers sufficient processing power for a wide range of embedded applications.

Power Supplies (V): 5

Operates at a standard voltage level, ensuring compatibility with common power sources.

No. of Terminals: 144

Provides ample connectivity options for interfacing with external components and peripherals.

Package Style: FLATPACK

Facilitates easy installation and replacement of the microcontroller in various electronic devices.

Minimum Supply Voltage: 4.5 V

Ensures reliable operation even during voltage fluctuations or low-power conditions.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for automotive and industrial applications.

CPU Family: 80166

Belongs to a well-established and reliable family of processors, ensuring performance and compatibility.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold environments, expanding its use cases.

Terminal Finish: TIN LEAD

Provides good solderability and electrical conductivity for reliable connections.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling sensor interfacing and data acquisition.

Terminal Position: QUAD

Offers a compact and efficient terminal layout for space-constrained designs.

Maximum Seated Height: 4.1 mm

Low-profile design ideal for applications with height restrictions.

Width: 28 mm

Compact dimensions suitable for small form factor devices and PCB designs.

External Data Bus Width: 16

Enables efficient data transfer between the microcontroller and external memory or devices.

Maximum Clock Frequency: 50 MHz

Offers high-speed processing capabilities for quick execution of instructions.

Length: 28 mm

Balanced dimensions for space-efficient PCB layout and integration in various systems.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliable performance in automotive electronics.

Peripheral IC Type: MICROCONTROLLER

Integration of various peripheral functions in a single chip, reducing component count and simplifying design.

RAM Bytes: 3072

Adequate memory capacity for storing program data and variables during operation.

Technology: CMOS

Utilizes low power consumption CMOS technology, suitable for battery-powered or energy-efficient applications.

Terminal Form: GULL WING

Enhances mechanical strength and solder joint reliability for robust PCB assembly.

Maximum Supply Current: 148 mA

Efficient power usage at maximum load conditions, reducing power consumption and heat dissipation.

Nominal Supply Voltage: 5 V

Standard supply voltage ensures compatibility with a wide range of electronic systems and components.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of motors, actuators, and other devices.

Terminal Pitch: 0.65 mm

Fine pitch spacing for densely populated PCB layouts, maximizing component density.

Speed: 40 rpm

Offers high-speed operation for responsive control and data processing in real-time applications.

No. of I/O Lines: 111

Provides numerous input/output options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers SAK-C167CS-L40M attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

80166

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e0

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

3072

Maximum Seated Height:

4.1 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

148 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

SAK-C167CS-L40M Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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