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SAK-C167CS-L33MCA+

Infineon Technologies

SAK-C167CS-L33MCA+ by Infineon Technologies

SAK-C167CS-L33MCA+ by Infineon: 16-bit microcontroller with 24-bit address bus, 40 MHz clock frequency. Ideal for automotive applications due to its CMOS technology, PWM channels, and MROM programmability. Operates in wide temperature range (-40 to 125 °C) with 111 I/O lines for versatile connectivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 1,494 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Digiode

USA . 725 parts In-Stock

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725

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LIBRA Elektronik GmbH

Germany . 18 parts In-Stock

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Semicontronic

India . 544 parts In-Stock

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$5.000

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$4.875

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$4.850

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544

$5.000

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$4.850

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AZTECH Wire

Italy . 502 parts In-Stock

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$8.322

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Ampacity Inc.

Singapore . 470 parts In-Stock

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$9.000

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470

$9.000

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Modulus Dynamics

Lithuania . 1,332 parts In-Stock

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$51.213

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$49.164

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$47.116

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$47.116

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Aztec Data Supply Inc.

USA . 870 parts In-Stock

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$61.839

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Authorized Procurement Solutions

USA . 14,000 parts In-Stock

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Argo Parts USA

USA . 2,607 parts In-Stock

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Continental Prestige Electronics

USA . 2,373 parts In-Stock

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Corphita

USA . 528 parts In-Stock

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Aranea Global

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Overview

Upgrade your projects with the SAK-C167CS-L33MCA+ by Infineon Technologies! This high-quality microcontroller offers unmatched performance and reliability, thanks to its innovative design and cutting-edge technology. Ideal for automotive applications, this product provides a seamless experience with its advanced features and capabilities. Take your creations to the next level with the SAK-C167CS-L33MCA+ and unlock a world of possibilities. Experience the value and benefits this microcontroller brings to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 5.5 V

Allows for a higher supply voltage which can be useful in applications where higher power requirements are needed.

Bit Size: 16

16-bit architecture allows for handling larger data sizes and more complex operations, making the microcontroller suitable for advanced applications.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast processing speeds, making the microcontroller suitable for applications that require quick response times.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various environments.

Nominal Supply Voltage: 5 V

Standard supply voltage of 5V makes it compatible with many electronic systems and components, providing versatility in integration.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product includes various built-in peripherals and features that streamline the design process and reduce the need for additional components.

Technical Specifications

Microcontrollers SAK-C167CS-L33MCA+ attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

ROM Programmability:

MROM

Maximum Seated Height:

4.1 mm

Speed:

33 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

SAK-C167CS-L33MCA+ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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