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SAK-C167CR-LMHA

Infineon Technologies

SAK-C167CR-LMHA by Infineon Technologies

SAK-C167CR-LMHA by Infineon: 16-bit microcontroller with 24-bit address bus, 5V supply, and 66MHz clock freq. Ideal for automotive applications due to -40 to 125 °C operating temp range. Features ADC channels, PWM support, and 2048 bytes of RAM for versatile functionality.

Median Price

$27.830

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$27.830

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ComSIT Distribution GmbH

Germany . 3,752 parts In-Stock

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ComSIT USA

USA . 3,752 parts In-Stock

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Digiode

USA . 817 parts In-Stock

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Vyrian

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Chip Stock

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Zilex Electronics Inc.

Canada . 17 parts In-Stock

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Connector Distribution Corp

USA . 8 parts In-Stock

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Right Parts Inc.

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Pegasus Components GmbH

Germany . 6 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 406 parts In-Stock

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$1.000

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Semicontronic

India . 2,105 parts In-Stock

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$5.000

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$4.875

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$4.850

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AZTECH Wire

Italy . 750 parts In-Stock

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$15.342

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Andel Nordic

Denmark . 4,416 parts In-Stock

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$19.160

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$13.415

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Continental Prestige Electronics

USA . 1,276 parts In-Stock

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$27.830

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$27.273

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Modulus Dynamics

Lithuania . 1,825 parts In-Stock

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$38.050

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$36.528

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$35.006

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

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A-Z Elektronik GmbH

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Corohmni

South Africa . 1,849 parts In-Stock

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Corphita

USA . 837 parts In-Stock

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Metaverse IC Inc.

Canada . 230 parts In-Stock

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Kepictronics

USA . 87 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the SAK-C167CR-LMHA microcontroller by Infineon Technologies. Crafted with precision and expertise, this top-of-the-line product offers unmatched reliability and performance in a wide range of applications. Whether you're looking to streamline your automotive systems or enhance your industrial processes, this microcontroller delivers unrivaled value, efficiency, and versatility. Elevate your projects to the next level with the SAK-C167CR-LMHA and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product sturdy and affordable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and cost.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of input voltages.

Address Bus Width: 24

A wider address bus allows for greater memory addressing capabilities, enabling more complex applications.

Package Shape: SQUARE

Square packages are space-efficient and easy to mount, making the product suitable for compact designs.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle data processing efficiently for a variety of tasks.

Power Supplies (V): 5

Operating at a standard voltage of 5V, this microcontroller is compatible with many other electronic components.

No. of Terminals: 144

With a high number of terminals, this microcontroller can support a wide range of input and output connections.

Package Style (Meter): FLATPACK

Flatpack packages are easy to install and provide good thermal conductivity, enhancing performance and reliability.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions.

CPU Family: 80166

Part of the 80166 CPU family, this microcontroller offers advanced features and capabilities for demanding applications.

RAM Bytes: 2048

With 2048 bytes of RAM, this microcontroller can store and process data efficiently for complex tasks.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product combines integrated peripherals and processing capabilities in a single chip, simplifying design and reducing costs.

Technical Specifications

Microcontrollers SAK-C167CR-LMHA attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

80166

Maximum Clock Frequency:

66 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e0

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

Maximum Seated Height:

4.1 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

120 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

SAK-C167CR-LMHA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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