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SAK-C167CR-LMHA+

Infineon Technologies

SAK-C167CR-LMHA+ by Infineon Technologies

SAK-C167CR-LMHA+ by Infineon: 16-bit C166 CPU, 24-bit address bus, 5V supply for automotive applications. Features include 2048 bytes RAM, 25MHz clock frequency, and PWM channels. Ideal for microcontroller projects requiring high-speed processing in automotive environments.

Median Price

$21.415

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Bristol Electronics

USA . 2 parts In-Stock

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$15.000

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Nova Conductors

Japan . 100 parts In-Stock

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$27.830

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ComSIT Distribution GmbH

Germany . 9,033 parts In-Stock

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ComSIT USA

USA . 9,033 parts In-Stock

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Vyrian

USA . 1,099 parts In-Stock

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Bas Electronics GmbH & Co. KG

Germany . 336 parts In-Stock

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Digiode

USA . 263 parts In-Stock

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Chip Stock

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LIBRA Elektronik GmbH

Germany . 27 parts In-Stock

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Cyclops Electronics Ltd

UK . 6 parts In-Stock

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Pegasus Components GmbH

Germany . 5 parts In-Stock

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Contempo Components LLC

USA . 3 parts In-Stock

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NAC Semi

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Distributors (Availability)

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AZTECH Wire

Italy . 524 parts In-Stock

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$6.980

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Semicontronic

India . 1,140 parts In-Stock

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$20.000

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$19.500

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$19.400

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Modulus Dynamics

Lithuania . 18 parts In-Stock

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$23.485

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$22.546

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$21.606

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$23.485

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$21.606

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Aztec Data Supply Inc.

USA . 2,552 parts In-Stock

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$24.350

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Aranea Global

USA . 100 parts In-Stock

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$27.273

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$26.182

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$27.273

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Continental Prestige Electronics

USA . 3,356 parts In-Stock

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$27.830

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$27.273

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$27.830

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Ampacity Inc.

Singapore . 698 parts In-Stock

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$31.000

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Corohmni

South Africa . 5 parts In-Stock

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$41.619

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Andel Nordic

Denmark . 8,029 parts In-Stock

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$33.069

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Argo Parts USA

USA . 1,568 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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Corphita

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EMSNET (Excess)

USA . 4 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the SAK-C167CR-LMHA+ microcontroller by Infineon Technologies. Designed for automotive applications, this high-quality device offers unparalleled performance and reliability. With a maximum clock frequency of 25 MHz and a wide range of I/O lines, this microcontroller delivers superior capabilities for your projects. Trust Infineon's expertise in microcontrollers to bring innovation and efficiency to your designs. Upgrade your systems with the SAK-C167CR-LMHA+ and experience the next level of performance in automotive electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material is lightweight and durable, making it ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power input, increasing its versatility.

Address Bus Width: 24

The 24-bit address bus width allows for a larger memory address space, enabling the microcontroller to access more data efficiently.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easier to integrate this microcontroller into tight spaces.

Bit Size: 16

With a 16-bit bit size, this microcontroller can process data in larger chunks, improving performance and efficiency.

Power Supplies (V): 5

Operating at a standard voltage of 5V, this microcontroller is compatible with a wide range of power sources and peripherals.

No. of Terminals: 144

The high number of terminals provide plenty of connectivity options for input/output devices, sensors, and other peripherals.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile design, reducing the overall height of the microcontroller and saving space on the PCB.

Minimum Supply Voltage: 4.5 V

With a low minimum supply voltage, this microcontroller can operate efficiently even with lower power sources, increasing its flexibility.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in harsh environments or high-temperature conditions.

CPU Family: C166

Part of the C166 CPU family, known for its high performance and reliability in embedded applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this microcontroller to function in extreme cold climates or refrigerated environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a solderable surface that is resistant to corrosion, ensuring long-term reliability in various operating conditions.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors and signals, expanding its input capabilities.

Terminal Position: QUAD

The quad terminal position offers a stable and secure connection for soldering, reducing the risk of mechanical failure or loose connections.

Maximum Seated Height: 2.75 mm

The low maximum seated height makes this microcontroller suitable for applications with limited vertical space or height restrictions.

Width: 28 mm

The compact width of 28mm allows for easy integration into small or densely populated PCB layouts, maximizing space efficiency.

External Data Bus Width: 16

The 16-bit external data bus width enables fast data transfer between the microcontroller and external memory devices, improving overall system performance.

Maximum Clock Frequency: 25 MHz

With a high maximum clock frequency of 25 MHz, this microcontroller can execute instructions quickly, supporting high-speed processing tasks.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance of 250°C ensures reliable soldering during PCB assembly, preventing damage or failure during manufacturing.

Length: 28 mm

The short length of 28mm further contributes to the compact form factor of this microcontroller, enabling space-saving integration in small devices or systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets stringent standards for temperature resistance, reliability, and performance in vehicle environments.

Peripheral IC Type: MICROCONTROLLER

With a focus on microcontroller functionality, this device provides integrated peripherals and interfaces for seamless control and communication in embedded systems.

RAM Bytes: 2048

With 2048 bytes of RAM, this microcontroller offers sufficient memory for temporary data storage and processing, supporting multitasking and complex algorithms.

Technology: CMOS

Utilizing CMOS technology, this microcontroller achieves low power consumption, high noise immunity, and reliable operation across a wide voltage range.

Terminal Form: GULL WING

The gull wing terminal form provides a reliable solder joint with increased mechanical strength, reducing the risk of solder cracking or joint failure.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V, this microcontroller is compatible with standard power sources, ensuring ease of integration in diverse systems.

PWM Channels: YES

The presence of PWM channels allows the microcontroller to generate precise analog output signals, facilitating motor control, power regulation, and signal modulation.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm enables high-density mounting on PCBs, maximizing board space utilization and supporting complex system designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this microcontroller is suitable for reflow soldering processes with moderate exposure to humidity, ensuring reliability in manufacturing.

Speed: 25 rpm

Operating at a clock speed of 25 rpm, this microcontroller can execute instructions and process data efficiently, supporting real-time control and high-performance applications.

No. of I/O Lines: 111

With 111 I/O lines, this microcontroller offers ample connectivity options for interfacing with external devices, sensors, and communication interfaces, enhancing system flexibility and functionality.

Technical Specifications

Microcontrollers SAK-C167CR-LMHA+ attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

C166

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

Maximum Seated Height:

2.75 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

SAK-C167CR-LMHA+ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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