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SAB-C501G-1R24N

Infineon Technologies

SAB-C501G-1R24N by Infineon Technologies

SAB-C501G-1R24N by Infineon Technologies is an 8051 microcontroller with 8-bit size, 16-bit address bus width, and max clock frequency of 24 MHz. It is used in commercial applications requiring a microcontroller with ROM words of 8192, RAM bytes of 256, and external data bus width of 8 bits.

Median Price

$9.700

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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DF Sales Co.

USA . 1,500 parts In-Stock

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$9.700

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DF Sales Co.

USA . 1,000 parts In-Stock

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$9.700

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Halfin

Belgium . 7,500 parts In-Stock

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Digiode

USA . 923 parts In-Stock

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Vyrian

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R&J Components

USA . 50 parts In-Stock

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Nova Conductors

Japan . 34 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 629 parts In-Stock

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$5.247

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Ampacity Inc.

Singapore . 1,328 parts In-Stock

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$33.000

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Corohmni

South Africa . 1,107 parts In-Stock

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$37.585

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Aztec Data Supply Inc.

USA . 3,420 parts In-Stock

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$58.470

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Modulus Dynamics

Lithuania . 728 parts In-Stock

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$73.857

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$70.903

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$67.948

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Argo Parts USA

USA . 4,333 parts In-Stock

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Continental Prestige Electronics

USA . 2,576 parts In-Stock

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Corphita

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Aranea Global

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Overview

Unlock endless possibilities with the SAB-C501G-1R24N microcontroller by Infineon Technologies. Crafted with precision and quality, this innovative product is designed to revolutionize your applications with its superior performance and reliability. Whether you're looking to enhance your IoT devices, automation systems, or consumer electronics, this microcontroller offers unmatched value, benefits, and advantages that will take your projects to the next level. Trust in Infineon Technologies to deliver excellence in every aspect, and experience the difference with the SAB-C501G-1R24N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The package body material of PLASTIC/EPOXY ensures durability and protection for the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V allows for flexibility in power supply options, accommodating a wide range of applications.

Address Bus Width: 16

With a wide address bus width of 16, the microcontroller can access a large memory space, enabling it to handle complex tasks efficiently.

Package Shape: SQUARE

The square package shape provides uniformity in design, making it easier to place and secure the microcontroller on a PCB.

Bit Size: 8

The 8-bit architecture allows for efficient processing of data in byte-sized chunks, making the microcontroller suitable for a wide range of applications.

Power Supplies (V): 5

With a power supply of 5 V, the microcontroller can operate reliably within standard voltage ranges, ensuring stability in performance.

No. of Terminals: 44

The 44 terminals provide ample connectivity options for interfacing with external components, allowing for versatile and customizable applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact form factor while providing adequate protection, making it suitable for space-constrained applications.

Minimum Supply Voltage: 4.25 V

The minimum supply voltage of 4.25 V ensures that the microcontroller can operate within a safe voltage range, safeguarding against potential damage.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, the microcontroller can withstand harsh environmental conditions, ensuring reliability in various applications.

CPU Family: 8051

The 8051 CPU family is well-established and widely supported, allowing for seamless integration and development of applications with extensive resources available.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the microcontroller can reliably function in a wide range of temperature conditions, making it versatile for different environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent solderability and conductivity, ensuring a reliable electrical connection for optimal performance.

Terminal Position: QUAD

The quad terminal position offers secure placement and easy soldering onto a PCB, ensuring stable connections and reliable operation.

ROM Words: 8192

With 8192 ROM words, the microcontroller can store a large amount of program instructions, enabling the execution of complex algorithms and functions.

Maximum Seated Height: 4.57 mm

The low maximum seated height of 4.57 mm allows for a slim profile, making the microcontroller suitable for compact and space-constrained designs.

Width: 16.56 mm

The width of 16.56 mm offers a balance between compactness and sufficient space for connectivity, making the microcontroller versatile for various applications.

External Data Bus Width: 8

With an external data bus width of 8, the microcontroller can efficiently transfer data between internal and external components, enhancing overall system performance.

Maximum Clock Frequency: 24 MHz

The high maximum clock frequency of 24 MHz allows for fast processing speeds, enabling rapid execution of instructions and tasks for enhanced performance.

Length: 16.56 mm

The length of 16.56 mm provides a compact form factor while accommodating the necessary components and connections, making the microcontroller suitable for space-saving designs.

Temperature Grade: COMMERCIAL

With a commercial temperature grade, the microcontroller is designed to operate within standard temperature ranges, ensuring reliable performance in commercial applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the device integrates various peripherals and processing capabilities onto a single chip, offering a cost-effective and space-efficient solution for embedded systems.

RAM Bytes: 256

With 256 RAM bytes, the microcontroller can efficiently store and access data during runtime, enabling smooth execution of programs and tasks.

Technology: CMOS

The CMOS technology used in the microcontroller offers low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Terminal Form: J BEND

The J bend terminal form facilitates easy installation and soldering onto a PCB, ensuring secure connections and reliable operation.

Maximum Supply Current: 36.2 mA

With a maximum supply current of 36.2 mA, the microcontroller operates efficiently within specified power limits, minimizing heat dissipation and energy consumption.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V provides a stable power source for the microcontroller, ensuring consistent and reliable operation in various applications.

ROM Programmability: MROM

With MROM programmability, the contents of the ROM in the microcontroller are fixed and cannot be altered, providing secure and stable operation for critical functions.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch offers compatibility with standard PCB layouts, making it easy to integrate the microcontroller into existing designs and systems.

Speed: 24 rpm

With a speed of 24 rpm, the microcontroller can process instructions and data at a rapid pace, enabling quick response times and efficient operation in real-time applications.

No. of I/O Lines: 32

The 32 I/O lines provide ample interfacing options for connecting with external devices and sensors, making the microcontroller versatile for a wide range of input and output requirements.

Technical Specifications

Microcontrollers SAB-C501G-1R24N attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

NO

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e0

Length:

16.56 mm

No. of I/O Lines:

32

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

4.57 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

36.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.25 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.56 mm

Peripheral IC Type:

Trade Compliance

SAB-C501G-1R24N Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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