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SAB-C504-2E24M

Infineon Technologies

SAB-C504-2E24M by Infineon Technologies

SAB-C504-2E24M by Infineon: Microcontroller with 8-bit size, 16-bit address bus, and 40 MHz clock frequency. Ideal for commercial applications requiring a max supply voltage of 5.5 V and operating temperature range of 0-70 °C. Features include ADC channels, PWM support, and OTPROM programmability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 417 parts In-Stock

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417

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Digiode

USA . 385 parts In-Stock

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385

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Nova Conductors

Japan . 86 parts In-Stock

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86

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,634 parts In-Stock

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$14.000

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1,634

$14.000

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Corohmni

South Africa . 515 parts In-Stock

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$28.229

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515

$28.229

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Modulus Dynamics

Lithuania . 4,631 parts In-Stock

1+ parts

$64.294

100+ parts

$61.722

1k+ parts

$59.150

10k+ parts

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4,631

$64.294

$61.722

$59.150

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A-Z Elektronik GmbH

Germany . 11,953 parts In-Stock

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11,953

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Continental Prestige Electronics

USA . 3,759 parts In-Stock

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3,759

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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Argo Parts USA

USA . 1,179 parts In-Stock

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1,179

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Metaverse IC Inc.

Canada . 1,089 parts In-Stock

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1,089

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Netroflash

USA . 500 parts In-Stock

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500

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Corphita

USA . 426 parts In-Stock

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426

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Overview

Unlock endless possibilities with the SAB-C504-2E24M microcontroller by Infineon Technologies. This cutting-edge device offers unparalleled quality and reliability, making it the top choice for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers exceptional performance and efficiency. Experience seamless integration, enhanced functionality, and superior control with the SAB-C504-2E24M. Upgrade your projects today with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external factors, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage provides flexibility in power requirements and compatibility with various voltage sources.

Address Bus Width: 16

Wide address bus width allows for efficient data transfer and processing, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

Square package shape facilitates easy installation and PCB layout, optimizing space utilization and design simplicity.

Bit Size: 8

8-bit architecture provides a good balance between processing power and efficiency, suitable for a wide range of applications.

No. of Terminals: 44

Ample number of terminals offer versatility in connectivity options and peripheral integration, making the product highly adaptable to different configurations.

Package Style (Meter): FLATPACK

Flatpack package style provides a compact and slim profile, ideal for space-constrained applications where size and weight are critical factors.

Minimum Supply Voltage: 4.25 V

Low minimum supply voltage ensures efficient power usage and extends battery life, making the product energy-efficient and cost-effective.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions, enhancing the product's durability and stability.

Minimum Operating Temperature: 0 °C

Wide operating temperature range allows for versatile use in various climates and settings, making the product suitable for a diverse range of applications.

ADC Channels: YES

Built-in ADC channels enable precise analog signal conversion, making the product well-suited for sensor interfacing and data acquisition applications.

Terminal Position: QUAD

Quad terminal position offers efficient signal routing and layout flexibility, simplifying PCB design and reducing signal interference.

Maximum Seated Height: 2.45 mm

Low maximum seated height allows for a slim and compact package design, ideal for space-constrained applications with height restrictions.

Width: 10 mm

Narrow width dimension enables easy integration into tight spaces and compact electronics designs, enhancing the product's versatility and adaptability.

External Data Bus Width: 8

8-bit external data bus width optimizes data transfer efficiency and processing speed, enhancing the overall performance of the microcontroller.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency ensures fast and responsive data processing, making the product suitable for high-speed applications that require rapid computation.

Length: 10 mm

Compact length dimension contributes to a space-saving and streamlined product design, ideal for applications where size and form factor are critical considerations.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation within standard temperature ranges, making the product suitable for commercial and industrial applications.

Peripheral IC Type: MICROCONTROLLER

Microcontroller peripheral IC type offers integrated hardware capabilities for various functions, reducing external component requirements and simplifying system design.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, resulting in efficient operation and reliable performance of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form offers secure solder connections and mechanical strength, ensuring robust and reliable electrical connections for stable operation.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage simplifies power compatibility and integration with existing systems, making the product versatile and easy to implement.

PWM Channels: YES

Integrated PWM channels enable precise control of analog output signals, making the product suitable for motor control, LED dimming, and other pulse-width modulation applications.

ROM Programmability: OTPROM

One-Time Programmable ROM provides secure and permanent storage of essential firmware and data, ensuring long-term reliability and data integrity of the microcontroller.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for dense and compact terminal layout, optimizing PCB space utilization and signal routing efficiency for efficient system integration.

Speed: 24 rpm

High processing speed enables fast data handling and computation, making the product suitable for real-time applications that require quick response and high performance.

No. of I/O Lines: 32

Abundance of I/O lines facilitates versatile interfacing with external devices and peripherals, enhancing the product's connectivity and compatibility with diverse systems.

Technical Specifications

Microcontrollers SAB-C504-2E24M attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

ROM Programmability:

OTPROM

Maximum Seated Height:

2.45 mm

Speed:

24 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.25 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

SAB-C504-2E24M Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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