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SAB-C165-L25FHA

Infineon Technologies

SAB-C165-L25FHA by Infineon Technologies

Infineon's SAB-C165-L25FHA microcontroller features 16-bit size, 40 MHz clock frequency, and 77 I/O lines. Ideal for commercial applications, this CMOS technology-based device operates b/w 0-70°C with a supply voltage range of 4.5-5.5 V.

Median Price

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Lifecycle Status

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5

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1k+

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Vyrian

USA . 993 parts In-Stock

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Digiode

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Nova Conductors

Japan . 48 parts In-Stock

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Zilex Electronics Inc.

Canada . 13 parts In-Stock

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Pegasus Components GmbH

Germany . 9 parts In-Stock

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AZTECH Wire

Italy . 223 parts In-Stock

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$10.154

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Ampacity Inc.

Singapore . 577 parts In-Stock

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Semicontronic

India . 212 parts In-Stock

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$26.000

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$25.350

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$25.220

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Corohmni

South Africa . 987 parts In-Stock

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$31.361

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Modulus Dynamics

Lithuania . 3,258 parts In-Stock

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$39.301

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$37.729

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$36.157

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Andel Nordic

Denmark . 2,425 parts In-Stock

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$43.930

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$30.754

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Aztec Data Supply Inc.

USA . 4,613 parts In-Stock

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Bastille Electronics

Australia . 4,888 parts In-Stock

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Microchip USA

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Argo Parts USA

USA . 2,533 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

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Perfect Parts

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Kepictronics

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Continental Prestige Electronics

USA . 132 parts In-Stock

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Overview

Unleash the power of the SAB-C165-L25FHA by Infineon Technologies and experience unmatched performance and reliability. Crafted with precision by a leading manufacturer in the industry, this microcontroller offers endless possibilities for your projects. Whether you're designing automotive systems, industrial controls, or consumer electronics, this versatile device delivers exceptional value and efficiency. Say goodbye to limitations and hello to innovation with the SAB-C165-L25FHA. Elevate your creations and unleash your creativity with this game-changing microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during manufacturing process.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

Address Bus Width: 24

A wider address bus width enables the microcontroller to access larger memory spaces and process more data efficiently.

Bit Size: 16

16-bit architecture offers a good balance between performance and cost, making it suitable for a wide range of applications.

No. of Terminals: 100

Having a higher number of terminals provides more connectivity options and flexibility in interfacing with other components.

Maximum Clock Frequency: 40 MHz

Higher clock frequency allows for faster processing speeds and improved overall performance of the microcontroller.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripheral functions on a single chip, reducing the need for external components and simplifying system design.

Technical Specifications

Microcontrollers SAB-C165-L25FHA attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

NO

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

77

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SAB-C165-L25FHA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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