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LH1262CB

Infineon Technologies

LH1262CB by Infineon Technologies

LH1262CB by Infineon Technologies is a separate optoelectronic device with 2 elements. It operates in temperatures ranging from -40°C to 100°C, making it suitable for various applications. The terminal finish is Tin/Lead (Sn/Pb), ensuring reliable performance in diverse environments.

Median Price

$2.420

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,551 parts In-Stock

1+ parts

$1.178

100+ parts

$1.082

1k+ parts

$1.046

10k+ parts

-

1,551

$1.178

$1.082

$1.046

-

Chip1Stop

Japan . 1,619 parts In-Stock

1+ parts

$2.420

100+ parts

-

1k+ parts

-

10k+ parts

-

1,619

$2.420

-

-

-

Mouser Electronics

USA . 3,659 parts In-Stock

1+ parts

$3.700

100+ parts

$2.940

1k+ parts

$2.240

10k+ parts

$2.230

3,659

$3.700

$2.940

$2.240

$2.230

DigiKey

USA . 2,043 parts In-Stock

1+ parts

$3.740

100+ parts

$2.969

1k+ parts

$2.644

10k+ parts

-

2,043

$3.740

$2.969

$2.644

-

Verical

USA . 1,619 parts In-Stock

1+ parts

-

100+ parts

$1.191

1k+ parts

$1.155

10k+ parts

-

1,619

-

$1.191

$1.155

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 120 parts In-Stock

1+ parts

$1.119

100+ parts

-

1k+ parts

-

10k+ parts

-

120

$1.119

-

-

-

Vyrian

USA . 84,534 parts In-Stock

1+ parts

$1.178

100+ parts

-

1k+ parts

-

10k+ parts

-

84,534

$1.178

-

-

-

EXC GmbH

Germany . 199 parts In-Stock

1+ parts

$2.602

100+ parts

-

1k+ parts

-

10k+ parts

-

199

$2.602

-

-

-

Zilex Electronics Inc.

Canada . 29 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29

-

-

-

-

Speed Components Ltd

Israel . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,233 parts In-Stock

1+ parts

$0.589

100+ parts

$0.565

1k+ parts

$0.542

10k+ parts

-

3,233

$0.589

$0.565

$0.542

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$0.839

100+ parts

$0.763

1k+ parts

$0.688

10k+ parts

-

3,000

$0.839

$0.763

$0.688

-

Corphita

USA . 534 parts In-Stock

1+ parts

$1.060

100+ parts

-

1k+ parts

-

10k+ parts

-

534

$1.060

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 29,054 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29,054

-

-

-

-

Perfect Parts

USA . 840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

840

-

-

-

-

Overview

Discover the LH1262CB by Infineon Technologies, a high-quality optoelectronic device with separate, 2 elements configuration. This innovative product offers unmatched reliability and performance, making it ideal for a wide range of applications. From industrial automation to automotive safety systems, the LH1262CB provides exceptional value and benefits to customers looking for cutting-edge solutions. Trust in Infineon Technologies for superior products that exceed expectations.

Feature Benefit Bullets

Configuration: SEPARATE, 2 ELEMENTS

Having a separate configuration with 2 elements allows for more flexibility and customization in the application of the optoelectronic device.

No. of Functions: 2

With 2 distinct functions, this optoelectronic device can perform multiple tasks efficiently, making it a versatile choice for various applications.

Optoelectronic Type: OPTOELECTRONIC DEVICE

Being an optoelectronic device, this product can convert electrical signals into light signals or vice versa, enabling seamless integration into optoelectronic systems.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100°C ensures that this optoelectronic device can withstand rigorous operating conditions without compromising its performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this product to function effectively even in extremely cold environments, increasing its usability across a wide range of operating conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides reliable and secure connections, ensuring the proper functioning of the optoelectronic device in various circuit configurations.

Technical Specifications

Other Function Optoelectronics LH1262CB attributes and parameters. Explore more Other Function Optoelectronics devices from Infineon Technologies

Specs

Configuration:

SEPARATE, 2 ELEMENTS

JESD-609 Code:

e0

No. of Functions:

2

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Terminal Finish:

Trade Compliance

LH1262CB Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

NSN

5962-01-503-0959, 5962015030959

NIIN

015030959

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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