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ITS612N1E3230

Infineon Technologies

ITS612N1E3230 by Infineon Technologies

Infineon's ITS612N1E3230 is a Peripheral Driver with 2 functions, operating at 5-34V. It offers built-in protections for transient, over/under voltage & current, thermal issues. Ideal for applications requiring a CMOS technology-based buffer/inverter peripheral driver with sink output flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,129 parts In-Stock

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1,129

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Digiode

USA . 679 parts In-Stock

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679

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ComSIT Distribution GmbH

Germany . 51 parts In-Stock

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51

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Ampacity Inc.

Singapore . 139 parts In-Stock

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$8.500

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139

$8.500

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Modulus Dynamics

Lithuania . 435 parts In-Stock

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$10.153

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$9.747

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$9.341

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435

$10.153

$9.747

$9.341

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AZTECH Wire

Italy . 836 parts In-Stock

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$13.320

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836

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A-Z Elektronik GmbH

Germany . 5,823 parts In-Stock

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5,823

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Alle Elektronik GmbH

Germany . 3,430 parts In-Stock

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3,430

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Corphita

USA . 690 parts In-Stock

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690

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Discover the power of Infineon Technologies with the ITS612N1E3230, a top-of-the-line Peripheral Driver designed to deliver exceptional performance and reliability. With built-in protections against transient, over current, over voltage, thermal, and under voltage situations, this product ensures the safety of your systems. Ideal for a wide range of applications, this driver offers a nominal supply voltage of 12V and a maximum supply voltage of 34V, making it versatile and efficient. Trust in the quality and excellence that Infineon Technologies brings to the table, providing you with a valuable solution that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the components inside, making the peripheral driver suitable for various environmental conditions.

Maximum Supply Voltage: 34 V

With a high maximum supply voltage of 34 V, this peripheral driver can handle a wide range of input voltages, increasing its versatility for different applications.

No. of Functions: 2

Having 2 functions allows this peripheral driver to perform multiple tasks simultaneously, making it efficient and versatile in driving peripherals.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and reliability of connected peripherals by safeguarding against various electrical faults and fluctuations.

Power Supplies (V): 12

With a power supply of 12 V, this peripheral driver can efficiently drive peripherals that require this specific voltage, ensuring compatibility with a wide range of devices.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade allows this peripheral driver to operate within a wide temperature range, making it suitable for industrial and commercial applications.

Nominal Output Peak Current Limit: 4.4 A

The high nominal output peak current limit of 4.4 A enables this peripheral driver to deliver sufficient power to connected peripherals, ensuring they operate at their optimal performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter based peripheral driver ensures efficient signal transmission and processing, enhancing the overall performance of connected peripherals.

Technical Specifications

Peripheral Drivers ITS612N1E3230 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PSFM-T7

No. of Functions:

2

No. of Terminals:

7

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

4.4 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP7,.1,50TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

34 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

12 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Turn-off Time:

400 us

Turn-on Time:

400 us

Trade Compliance

ITS612N1E3230 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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