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ITS612N1HKSA1

Infineon Technologies

ITS612N1HKSA1 by Infineon Technologies

ITS612N1HKSA1 by Infineon Technologies is a peripheral driver with 2 functions, operating at 5-34V. It offers built-in protections against transient, over/under voltage & current, thermal issues. Ideal for applications requiring a 12V nominal supply, such as buffer or inverter-based interface ICs in commercial extended temperature environments.

Median Price

$0.813

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 228 parts In-Stock

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228

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Digiode

USA . 45 parts In-Stock

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$0.813

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45

$0.813

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Vyrian

USA . 7,972 parts In-Stock

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7,972

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Ampacity Inc.

Singapore . 228 parts In-Stock

1+ parts

$0.620

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228

$0.620

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Corphita

USA . 901 parts In-Stock

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$0.770

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901

$0.770

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Modulus Dynamics

Lithuania . 3,553 parts In-Stock

1+ parts

$6.293

100+ parts

$6.041

1k+ parts

$5.790

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3,553

$6.293

$6.041

$5.790

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AZTECH Wire

Italy . 606 parts In-Stock

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$16.401

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606

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QUARKTWIN TECHNOLOGY LTD

USA . 29,790 parts In-Stock

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29,790

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Aranea Global

USA . 1,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Perfect Parts

USA . 358 parts In-Stock

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358

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Microchip USA

USA . 197 parts In-Stock

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Overview

Enhance your electronic projects with the ITS612N1HKSA1 from Infineon Technologies, a leading manufacturer known for superior quality and reliability. This Peripheral Driver offers built-in protections against various electrical faults, ensuring safe and efficient operation. With its versatile applications in automotive systems, industrial controls, and more, this product delivers exceptional value and performance. Upgrade your designs with the ITS612N1HKSA1 and experience the benefits of precision engineering at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the peripheral driver, making it suitable for various operating conditions.

Maximum Supply Voltage: 34 V

Supports a wide range of supply voltages, making it versatile and compatible with different power sources.

No. of Functions: 2

Offers multiple functions in a single device, making it more efficient and cost-effective for driving peripheral components.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive protection features ensure the safety and reliability of connected peripherals by preventing damage from various electrical faults and environmental conditions.

No. of Terminals: 7

Sufficient number of terminals for connecting multiple peripherals or external devices to the driver, enabling more flexibility in system configurations.

Minimum Supply Voltage: 5 V

Supports low supply voltages, allowing for compatibility with a wide range of power sources and devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures stable performance even under harsh environmental conditions or extended use.

Nominal Supply Voltage: 12 V

Optimal nominal supply voltage for efficient performance of the peripheral driver and connected devices.

Technical Specifications

Peripheral Drivers ITS612N1HKSA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PZFM-T7

No. of Functions:

2

No. of Terminals:

7

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

4.4 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage:

34 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

12 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

400 us

Turn-on Time:

400 us

Trade Compliance

ITS612N1HKSA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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