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IRLS3036TRRPBF

Infineon Technologies

IRLS3036TRRPBF by Infineon Technologies

IRLS3036TRRPBF by Infineon Technologies is a N-CHANNEL Power FET with 60V DS Breakdown Voltage. It has a max IDM of 1100A and EAS of 290mJ, suitable for SWITCHING applications. With 0.0024 ohm RDS(on) and 380W Pdiss, it operates in ENHANCEMENT MODE at up to 175°C, making it ideal for high-power electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 3,600 parts In-Stock

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Vyrian

USA . 494 parts In-Stock

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Digiode

USA . 461 parts In-Stock

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Nova Conductors

Japan . 82 parts In-Stock

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Corohmni

South Africa . 195 parts In-Stock

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$0.304

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195

$0.304

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Modulus Dynamics

Lithuania . 20,993 parts In-Stock

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$1.101

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$1.057

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$1.013

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Aztec Data Supply Inc.

USA . 445 parts In-Stock

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$1.420

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$1.420

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AZTECH Wire

Italy . 340 parts In-Stock

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$6.268

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340

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Ampacity Inc.

Singapore . 1,007 parts In-Stock

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$11.050

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1,007

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Semicontronic

India . 578 parts In-Stock

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$26.050

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$25.399

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$25.268

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578

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Continental Prestige Electronics

USA . 1,576 parts In-Stock

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Argo Parts USA

USA . 796 parts In-Stock

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Microchip USA

USA . 296 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Corphita

USA . 34 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the IRLS3036TRRPBF by Infineon Technologies. This high-quality Power FET is designed for switching applications, guaranteeing efficiency and reliability in every use. With a maximum drain current of 195A and a minimum DS breakdown voltage of 60V, this N-channel transistor offers unparalleled performance. Whether you're in need of enhanced power management or improved energy efficiency, the IRLS3036TRRPBF is the perfect solution for all your needs. Upgrade your systems today and experience the superior quality and value that only Infineon Technologies can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the package lightweight and durable, ideal for portable or rugged applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower ON resistance and higher efficiency compared to P-CHANNEL FETs, making them a better choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage spikes, enhancing the reliability of the overall system.

Transistor Application: SWITCHING

Designed for efficient switching operations, making it suitable for power management applications where fast turn-on and turn-off times are critical.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, making it easier to integrate this FET into modern electronic devices.

Minimum DS Breakdown Voltage: 60 V

With a breakdown voltage of 60V, this FET can handle higher voltages without breakdown, ensuring reliable performance in high-voltage applications.

Maximum Pulsed Drain Current (IDM): 1100 A

High pulsed drain current rating allows for safe handling of high current spikes, making this FET suitable for demanding applications.

Maximum Power Dissipation (Abs): 380 W

With a high power dissipation rating, this FET can handle moderate to high power levels without overheating, ensuring reliability in high-power applications.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can operate reliably in high-temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) IRLS3036TRRPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

290 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

270 A

Maximum Drain Current (ID):

195 A

Maximum Drain-Source On Resistance:

.0024 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1100 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRLS3036TRRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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