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IRL530N

Infineon Technologies

IRL530N by Infineon Technologies

IRL530N by Infineon Technologies is a N-CHANNEL Power FET with 100V DS Breakdown Voltage. It features a max IDM of 60A and 0.12 ohm RDS(on), ideal for SWITCHING applications. With an EAS of 150mJ, it operates in ENHANCEMENT MODE at up to 175°C, making it suitable for high-power tasks.

Median Price

$1.230

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

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DF Sales Co.

USA . 50 parts In-Stock

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Forefront Electronics and Design

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American Microsemiconductor Inc.

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Vyrian

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Digiode

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Component Electronics Inc.

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Bristol Electronics

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Electronics Depot

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Component Sense

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MRC Electronics

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ACDS - Activité Composants Distribution Service

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Pegasus Components GmbH

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Holdelec - ElecDif-Pro

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Sunrise Surplus Inc.

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Nova Conductors

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Modulus Dynamics

Lithuania . 12,830 parts In-Stock

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AZTECH Wire

Italy . 627 parts In-Stock

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Ampacity Inc.

Singapore . 325 parts In-Stock

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Metaverse IC Inc.

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ChipstoGo Electronic ltd

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Overview

Unlock the power of technology with the IRL530N by Infineon Technologies. Designed with precision and reliability, this N-CHANNEL Power Field Effect Transistor (FET) offers seamless switching capabilities for a wide range of applications. Infineon Technologies' reputation for excellence ensures that this product is of the highest quality, providing customers with a valuable solution that delivers unmatched performance. Experience the benefits of enhanced efficiency and superior functionality with the IRL530N, setting new standards in the world of semiconductor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the packaging provides durability and protection for the FET, ensuring reliable performance in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher current carrying capabilities compared to P-channel FETs, making them suitable for high-power switching applications.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage allows the FET to handle higher voltages without breakdown, making it suitable for high voltage applications.

Maximum Pulsed Drain Current (IDM): 60 A

The high pulsed drain current rating enables the FET to handle high current spikes, making it suitable for applications that require brief high power operation.

Maximum Operating Temperature: 175 °C

The FET can operate at high temperatures without performance degradation, making it suitable for applications that require extended temperature operation.

Maximum Drain-Source On Resistance: 0.12 ohm

The low on-resistance of the FET results in minimal power loss and high efficiency during operation, making it suitable for high-power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) IRL530N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE, HIGH RELIABILITY

Avalanche Energy Rating (EAS):

150 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

225

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRL530N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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