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IRL1004SPBF

Infineon Technologies

IRL1004SPBF by Infineon Technologies

Infineon's IRL1004SPBF is a N-CHANNEL FET with 40V DS breakdown voltage, ideal for switching applications. Featuring 520A IDM and 0.0065 ohm RDS(on), it operates in enhancement mode with 175°C max temp. Its GULL WING terminals and built-in diode make it suitable for surface mount designs.

Median Price

$1.537

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 450 parts In-Stock

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Digiode

USA . 889 parts In-Stock

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Vyrian

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Chip Stock

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Contempo Components LLC

USA . 16 parts In-Stock

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ABC Electronics Ltd.

UK . 13 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$1.537

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$1.537

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Modulus Dynamics

Lithuania . 19,816 parts In-Stock

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$1.703

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$1.635

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$1.567

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AZTECH Wire

Italy . 782 parts In-Stock

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$5.158

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Ampacity Inc.

Singapore . 1,028 parts In-Stock

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$12.050

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Andel Nordic

Denmark . 288 parts In-Stock

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$22.840

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$15.991

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Component Stockers USA

USA . 578 parts In-Stock

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$99.990

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

Germany . 6,009 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,006 parts In-Stock

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Glotronic Ltd.

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Perfect Parts

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Corphita

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Overview

Unleash the power of Infineon Technologies with the IRL1004SPBF Power Field Effect Transistor. This high-quality N-CHANNEL transistor boasts a single configuration with a built-in diode, making it ideal for switching applications. With a maximum drain current of 130A and a low on-resistance of 0.0065 ohm, this transistor offers unmatched performance and efficiency. Whether you're looking to optimize your power management systems or enhance the capabilities of your electronic devices, the IRL1004SPBF is the ultimate solution. Trust in Infineon's expertise and elevate your projects to new heights with this cutting-edge FET.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher efficiency compared to P-channel FETs, making them a good choice for power switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient performance in such scenarios.

Surface Mount: YES

The surface-mount capability allows for easy and convenient installation on PCBs, reducing assembly time and footprint.

Maximum Pulsed Drain Current (IDM): 520 A

High maximum pulsed drain current allows for handling large transient loads or surges, making the FET suitable for high-power applications.

Avalanche Energy Rating (EAS): 700 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage spikes or surges, ensuring reliability in harsh conditions.

Maximum Drain-Source On Resistance: 0.0065 ohm

Low ON resistance leads to minimal power losses and efficient power dissipation, making the FET suitable for high-current applications.

Technical Specifications

Power Field Effect Transistors (FET) IRL1004SPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH RELIABILITY

Avalanche Energy Rating (EAS):

700 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

110 A

Maximum Drain Current (ID):

130 A

Maximum Drain-Source On Resistance:

.0065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

520 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRL1004SPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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