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IPW65R190CFDFKSA1

Infineon Technologies

IPW65R190CFDFKSA1 by Infineon Technologies

Infineon's IPW65R190CFDFKSA1 is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 57.2A IDM, 484mJ EAS, and 0.19 ohm RDS(ON). Operating from -55 to 150 °C, it has a max power dissipation of 151W in a FLANGE MOUNT package.

Median Price

$1.811

Lifecycle Status

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10

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1k+

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Arrow

USA . 148 parts In-Stock

1+ parts

$1.848

100+ parts

$1.747

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$1.848

$1.747

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Chip1Stop

Japan . 168 parts In-Stock

1+ parts

$3.824

100+ parts

$2.966

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168

$3.824

$2.966

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Verical

USA . 148 parts In-Stock

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$1.747

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148

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$1.747

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RS (Exports)

UK . 2 parts In-Stock

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$1.774

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$1.774

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Nova Conductors

Japan . 15 parts In-Stock

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$2.830

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$2.830

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Digiode

USA . 419 parts In-Stock

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$3.633

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Vyrian

USA . 8,981 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 60 parts In-Stock

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60

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Bristol Electronics

USA . 60 parts In-Stock

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Dan-Mar Components

USA . 60 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$0.500

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$0.455

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$0.410

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100

$0.500

$0.455

$0.410

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Aztec Data Supply Inc.

USA . 1,551 parts In-Stock

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$1.130

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1,551

$1.130

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Ampacity Inc.

Singapore . 127 parts In-Stock

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$1.510

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$1.510

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Corohmni

South Africa . 148 parts In-Stock

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$1.724

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148

$1.724

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Modulus Dynamics

Lithuania . 25,896 parts In-Stock

1+ parts

$1.861

100+ parts

$1.787

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$1.712

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25,896

$1.861

$1.787

$1.712

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Continental Prestige Electronics

USA . 5,739 parts In-Stock

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$2.830

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$2.773

5,739

$2.830

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$2.773

Argo Parts USA

USA . 1,540 parts In-Stock

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$2.830

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$2.830

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Corphita

USA . 4 parts In-Stock

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$3.442

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$3.442

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AZTECH Wire

Italy . 600 parts In-Stock

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$12.190

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$12.190

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Andel Nordic

Denmark . 127 parts In-Stock

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$59.110

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$41.377

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$41.377

127

$59.110

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$41.377

$41.377

Netroflash

USA . 2,000 parts In-Stock

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$2.773

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$2.688

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$2.632

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$2.773

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$2.632

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Microchip USA

USA . 1,950 parts In-Stock

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Perfect Parts

USA . 1,275 parts In-Stock

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Overview

Looking for a reliable power FET for your switching applications? Look no further than the IPW65R190CFDFKSA1 by Infineon Technologies. With a minimum DS breakdown voltage of 650V and a maximum drain-source on resistance of 0.19 ohm, this N-channel transistor offers exceptional performance and reliability. Whether you're in the industrial, automotive, or consumer electronics sector, this single with built-in diode configuration transistor is guaranteed to deliver the power you need. Trust Infineon's expertise and innovation to provide you with the quality and value you deserve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the transistor, ensuring reliability in different operating conditions.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used for higher power applications due to their superior conductivity and efficiency compared to P-CHANNEL types.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for a smoother switching operation and protection against back EMF, enhancing the overall performance and longevity of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control power flow in various circuits with high precision.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can withstand high voltage levels, making it suitable for high power applications where voltage spikes may occur.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and integrate into circuit designs, allowing for space-efficient configurations.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure connection to the circuit board, ensuring stable and reliable performance in various environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer precise control over the current flow, making them ideal for switching applications where accurate power management is required.

Maximum Pulsed Drain Current (IDM): 57.2 A

With a high pulsed drain current rating, this FET can handle sudden surges in current without overheating or failing, ensuring robust performance under peak demand.

Avalanche Energy Rating (EAS): 484 mJ

The high avalanche energy rating indicates the ability of the FET to withstand short-term overloads or voltage spikes, making it reliable in unpredictable operating conditions.

Maximum Drain Current (Abs) (ID): 17.5 A

The maximum drain current rating of 17.5 A allows for efficient power handling capabilities, making it suitable for high-current applications.

No. of Terminals: 3

Having 3 terminals simplifies circuit connections and allows for easy integration into various electronic designs.

Maximum Power Dissipation (Abs): 151 W

With a high power dissipation rating, this FET can efficiently dissipate heat generated during operation, ensuring reliable performance under high power loads.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides stability and easy mounting options, making it suitable for applications where secure attachment is essential.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making this FET an energy-efficient choice for various electronic applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range of up to 150°C, this FET can withstand elevated temperatures without compromising performance, ensuring reliability in demanding environments.

Transistor Element Material: SILICON

Silicon-based transistors offer excellent conductivity and temperature stability, providing consistent performance in a wide range of operating conditions.

Minimum Operating Temperature: -55 °C

The FET can operate at temperatures as low as -55°C, making it suitable for applications in cold environments or industrial settings with extreme temperature variations.

Terminal Finish: Tin (Sn)

Tin terminal finish provides corrosion resistance and ensures reliable electrical connections, extending the lifespan of the FET in harsh operating environments.

Maximum Drain-Source On Resistance: 0.19 ohm

Having low drain-source on resistance helps minimize power losses and improve efficiency in the circuit, making this FET an ideal choice for high-performance applications.

Terminal Position: SINGLE

Single terminal position simplifies the installation and connection process, ensuring easy integration into circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) IPW65R190CFDFKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

484 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

17.5 A

Maximum Drain Current (ID):

17.5 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

57.2 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPW65R190CFDFKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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