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IPW60R125C6FKSA1

Infineon Technologies

IPW60R125C6FKSA1 by Infineon Technologies

IPW60R125C6FKSA1 by Infineon Technologies is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It has a max IDM of 89A and 0.125 ohm Drain-Source On Resistance, making it ideal for SWITCHING applications. This SINGLE transistor operates in ENHANCEMENT MODE and can handle up to 150°C operating temperature.

Median Price

$4.810

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 39 parts In-Stock

1+ parts

$3.310

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-

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39

$3.310

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Farnell

UK . 72 parts In-Stock

1+ parts

$4.090

100+ parts

$2.210

1k+ parts

$2.080

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-

72

$4.090

$2.210

$2.080

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Mouser Electronics

USA . 164 parts In-Stock

1+ parts

$4.810

100+ parts

$2.600

1k+ parts

$2.500

10k+ parts

-

164

$4.810

$2.600

$2.500

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Arrow

USA . 760 parts In-Stock

1+ parts

$4.902

100+ parts

$2.600

1k+ parts

$2.474

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760

$4.902

$2.600

$2.474

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Newark

USA . 72 parts In-Stock

1+ parts

$4.950

100+ parts

$2.680

1k+ parts

$2.580

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72

$4.950

$2.680

$2.580

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DigiKey

USA . 93 parts In-Stock

1+ parts

$5.710

100+ parts

$3.224

1k+ parts

$2.277

10k+ parts

$2.186

93

$5.710

$3.224

$2.277

$2.186

Element14

Singapore . 145 parts In-Stock

1+ parts

$6.222

100+ parts

$3.752

1k+ parts

$3.214

10k+ parts

-

145

$6.222

$3.752

$3.214

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Rochester

USA . 1,148 parts In-Stock

1+ parts

-

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$2.190

1k+ parts

$1.960

10k+ parts

$1.840

1,148

-

$2.190

$1.960

$1.840

Verical

USA . 1,082 parts In-Stock

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$2.450

10k+ parts

$2.300

1,082

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$2.450

$2.300

EBV Elektronik

Germany . 240 parts In-Stock

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240

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Digiode

USA . 468 parts In-Stock

1+ parts

$2.480

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468

$2.480

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Rutronik

Germany . 9,360 parts In-Stock

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$2.060

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$2.060

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$2.060

$2.060

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Vyrian

USA . 8,609 parts In-Stock

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8,609

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Ashlea Components Ltd

UK . 527 parts In-Stock

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527

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Chip Stock

USA . 345 parts In-Stock

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345

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NAC Semi

USA . 240 parts In-Stock

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$7.220

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240

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$7.220

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 22,844 parts In-Stock

1+ parts

$0.343

100+ parts

$0.329

1k+ parts

$0.316

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22,844

$0.343

$0.329

$0.316

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Corphita

USA . 82 parts In-Stock

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$2.349

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82

$2.349

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Continental Prestige Electronics

USA . 181 parts In-Stock

1+ parts

$4.910

100+ parts

$3.070

1k+ parts

$2.590

10k+ parts

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181

$4.910

$3.070

$2.590

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Microchip USA

USA . 6,768 parts In-Stock

1+ parts

$19.040

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6,768

$19.040

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Perfect Parts

USA . 618 parts In-Stock

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618

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Eastek

USA . 240 parts In-Stock

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240

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unleash the power of cutting-edge technology with the IPW60R125C6FKSA1 by Infineon Technologies. As a leader in the industry, Infineon delivers top-quality Power Field Effect Transistors that exceed expectations. Whether you're looking to enhance your switching applications or improve overall efficiency, this N-CHANNEL transistor with a built-in diode offers unmatched performance and reliability. With a high DS Breakdown Voltage of 600V and a low on-resistance of 0.125 ohm, this transistor provides outstanding value and benefits for a wide range of electronic devices. Upgrade your projects today with the IPW60R125C6FKSA1!

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the transistor, ensuring durability and reliable performance.

Polarity or Channel Type - N-CHANNEL

N-CHANNEL transistors are commonly used for high power applications, providing efficient switching capabilities.

Minimum DS Breakdown Voltage - 600 V

High breakdown voltage allows the transistor to withstand high voltage applications, making it suitable for various industrial uses.

Operating Mode - ENHANCEMENT MODE

Enhancement mode transistors are easier to control and require less power to operate, making them energy efficient and reliable for switching applications.

Maximum Pulsed Drain Current (IDM) - 89 A

High pulsed drain current rating indicates the transistor can handle short bursts of high current, making it suitable for demanding applications.

Avalanche Energy Rating (EAS) - 636 mJ

High avalanche energy rating indicates the transistor can withstand high energy pulses, which is essential for protecting the device in high voltage applications.

Maximum Operating Temperature - 150 °C

High maximum operating temperature ensures the transistor can perform reliably in high temperature environments, increasing its versatility and durability.

Maximum Drain Current (ID) - 30 A

High drain current rating allows the transistor to handle large continuous currents, making it suitable for high power applications.

Maximum Drain-Source On Resistance - 0.125 ohm

Low drain-source on resistance indicates the transistor has high efficiency and minimal power loss during operation, enhancing its performance in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) IPW60R125C6FKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

636 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

89 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPW60R125C6FKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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