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IPI65R190C6XKSA1

Infineon Technologies

IPI65R190C6XKSA1 by Infineon Technologies

IPI65R190C6XKSA1 by Infineon Technologies is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. It features a max IDM of 66A and 0.19 ohm RDS(ON), suitable for SWITCHING applications. This SINGLE transistor in PLASTIC/EPOXY package is designed for ENHANCEMENT MODE operation, offering high performance in power electronics.

Median Price

$1.998

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$3.500

100+ parts

$2.380

1k+ parts

$1.700

10k+ parts

$1.700

2

$3.500

$2.380

$1.700

$1.700

Rochester

USA . 126,969 parts In-Stock

1+ parts

-

100+ parts

$1.640

1k+ parts

$1.470

10k+ parts

$1.380

126,969

-

$1.640

$1.470

$1.380

Verical

USA . 106,499 parts In-Stock

1+ parts

-

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-

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$1.837

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$1.725

106,499

-

-

$1.837

$1.725

DigiKey

USA . 1,474 parts In-Stock

1+ parts

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$2.160

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1,474

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-

$2.160

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Distributors (In-Stock)

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Digiode

USA . 279 parts In-Stock

1+ parts

$1.729

100+ parts

-

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279

$1.729

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Nova Conductors

Japan . 55 parts In-Stock

1+ parts

$2.241

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55

$2.241

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Vyrian

USA . 941 parts In-Stock

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941

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 673 parts In-Stock

1+ parts

$1.550

100+ parts

$1.511

1k+ parts

$1.504

10k+ parts

-

673

$1.550

$1.511

$1.504

-

Corphita

USA . 235 parts In-Stock

1+ parts

$1.638

100+ parts

-

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235

$1.638

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Aztec Data Supply Inc.

USA . 1,232 parts In-Stock

1+ parts

$1.661

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1,232

$1.661

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Modulus Dynamics

Lithuania . 21,492 parts In-Stock

1+ parts

$1.758

100+ parts

$1.688

1k+ parts

$1.617

10k+ parts

-

21,492

$1.758

$1.688

$1.617

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Corohmni

South Africa . 1,244 parts In-Stock

1+ parts

$1.883

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1,244

$1.883

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Component Stockers USA

USA . 8,742 parts In-Stock

1+ parts

$1.950

100+ parts

$1.840

1k+ parts

$3.150

10k+ parts

-

8,742

$1.950

$1.840

$3.150

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Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

$2.241

100+ parts

$2.129

1k+ parts

$2.023

10k+ parts

$1.994

50

$2.241

$2.129

$2.023

$1.994

Argo Parts USA

USA . 2,424 parts In-Stock

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$2.241

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2,424

$2.241

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Continental Prestige Electronics

USA . 1,912 parts In-Stock

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$2.241

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$2.196

1,912

$2.241

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$2.196

Ampacity Inc.

Singapore . 899 parts In-Stock

1+ parts

$3.370

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899

$3.370

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QUARKTWIN TECHNOLOGY LTD

USA . 23,353 parts In-Stock

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Eastek

USA . 8,500 parts In-Stock

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8,500

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Microchip USA

USA . 2,568 parts In-Stock

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2,568

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iodParts Technologies Inc.

India . 2,500 parts In-Stock

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2,500

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Unlock the power of innovation with the IPI65R190C6XKSA1 by Infineon Technologies. Designed with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance in switching applications. With a minimum DS Breakdown Voltage of 650V and a Maximum Pulsed Drain Current of 66A, this transistor ensures reliable and efficient operation. Its single configuration with built-in diode makes it a versatile choice for various projects. Experience the quality and reliability of Infineon Technologies with the IPI65R190C6XKSA1 and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protection for the internal components, making the product suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making them ideal for applications requiring high performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves efficiency by protecting against reverse voltage spikes, making the product more cost-effective and reliable.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast on/off switching times, making it suitable for power management and control purposes.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage applications without risk of failure, ensuring safe and reliable operation.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into circuit layouts and provides a compact form factor for space-constrained applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers secure and reliable connections to the circuit board, making it easy to install and ensuring consistent performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high gain and low threshold voltage, providing precise control over the switching operation and improving overall efficiency.

Maximum Pulsed Drain Current (IDM): 66 A

The high pulsed drain current rating allows for handling sudden spikes in current, making the FET suitable for applications with high peak power requirements.

Avalanche Energy Rating (EAS): 485 mJ

The high avalanche energy rating indicates the FET's ability to withstand energy surges without damage, ensuring long-term reliability in harsh operating conditions.

No. of Terminals: 3

With three terminals, this FET provides the necessary connections for efficient power switching and control in a compact package.

Package Style (Meter): IN-LINE

The in-line package style offers easy mounting and alignment on the circuit board, simplifying the assembly process for faster production.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides reliable performance and low power consumption, making the FET suitable for energy-efficient applications.

Transistor Element Material: SILICON

Silicon transistors are known for their high reliability and temperature stability, ensuring consistent performance over a wide range of operating conditions.

Terminal Finish: TIN

The tin terminal finish offers good solderability and corrosion resistance, ensuring a reliable electrical connection and long-term durability.

Maximum Drain-Source On Resistance: 0.19 ohm

The low drain-source on resistance results in minimal power loss and high efficiency during conduction, making the FET suitable for high-performance applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the connection setup and ensures consistent and reliable performance in the circuit layout.

Technical Specifications

Power Field Effect Transistors (FET) IPI65R190C6XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

485 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

66 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPI65R190C6XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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