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IPD70R1K4CEAUMA1

Infineon Technologies

IPD70R1K4CEAUMA1 by Infineon Technologies

IPD70R1K4CEAUMA1 by Infineon is a N-CHANNEL FET with 700V DS Breakdown Voltage, ideal for SWITCHING applications. It features a 8.3A Max Pulsed Drain Current and 26mJ Avalanche Energy Rating, operating in ENHANCEMENT MODE. With a compact SMALL OUTLINE package and low 1.4 ohm On Resistance, it's suitable for high-power electronics in various industries.

Median Price

$0.320

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,186 parts In-Stock

1+ parts

$1.070

100+ parts

$0.493

1k+ parts

$0.343

10k+ parts

$0.239

1,186

$1.070

$0.493

$0.343

$0.239

DigiKey

USA . 15 parts In-Stock

1+ parts

$1.110

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$1.110

-

-

-

Rochester

USA . 2,810 parts In-Stock

1+ parts

-

100+ parts

$0.283

1k+ parts

$0.235

10k+ parts

$0.210

2,810

-

$0.283

$0.235

$0.210

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.264

2,500

-

-

-

$0.264

Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.253

2,500

-

-

-

$0.253

Farnell

UK . 2,299 parts In-Stock

1+ parts

-

100+ parts

$0.357

1k+ parts

$0.235

10k+ parts

-

2,299

-

$0.357

$0.235

-

Element14

Singapore . 2,299 parts In-Stock

1+ parts

-

100+ parts

$0.496

1k+ parts

$0.312

10k+ parts

$0.296

2,299

-

$0.496

$0.312

$0.296

Verical

USA . 1,460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.262

1,460

-

-

-

$0.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 667 parts In-Stock

1+ parts

$0.253

100+ parts

-

1k+ parts

-

10k+ parts

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667

$0.253

-

-

-

Digiode

USA . 758 parts In-Stock

1+ parts

$0.778

100+ parts

-

1k+ parts

-

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758

$0.778

-

-

-

Cyclops Electronics Ltd

UK . 61 parts In-Stock

1+ parts

-

100+ parts

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61

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 767 parts In-Stock

1+ parts

$0.737

100+ parts

-

1k+ parts

-

10k+ parts

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767

$0.737

-

-

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Modulus Dynamics

Lithuania . 3,851 parts In-Stock

1+ parts

$1.678

100+ parts

$1.611

1k+ parts

$1.544

10k+ parts

-

3,851

$1.678

$1.611

$1.544

-

Microchip USA

USA . 487 parts In-Stock

1+ parts

$2.040

100+ parts

$2.040

1k+ parts

$2.040

10k+ parts

$2.030

487

$2.040

$2.040

$2.040

$2.030

Futuretech Components

Singapore . 35,000 parts In-Stock

1+ parts

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35,000

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Lixinc

USA . 18,944 parts In-Stock

1+ parts

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18,944

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QUARKTWIN TECHNOLOGY LTD

USA . 14,809 parts In-Stock

1+ parts

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14,809

-

-

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Perfect Parts

USA . 8,736 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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8,736

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Continental Prestige Electronics

USA . 2,350 parts In-Stock

1+ parts

-

100+ parts

$0.450

1k+ parts

$0.297

10k+ parts

$0.246

2,350

-

$0.450

$0.297

$0.246

Overview

Unlock the power of cutting-edge technology with the IPD70R1K4CEAUMA1 by Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance in switching applications. With a robust design featuring a built-in diode and a high DS breakdown voltage of 700V, this transistor ensures reliability and efficiency in every operation. Experience seamless functionality with its small outline package and gull wing terminals, making installation a breeze. Trust in the quality of Infineon Technologies to elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Suitable for various electronic applications where N-channel FETs are required.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient built-in diode for reverse current protection, adding versatility to the FET's use.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance.

Minimum DS Breakdown Voltage: 700 V

High breakdown voltage allows for use in high-power applications with greater reliability.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and space-saving on circuit boards.

Operational Mode: ENHANCEMENT MODE

Enhancement mode operation enables enhanced control over the transistor's conductivity.

Maximum Pulsed Drain Current (IDM): 8.3 A

High pulsed drain current capability suitable for handling sudden spikes in current.

Avalanche Energy Rating (EAS): 26 mJ

Good avalanche energy rating ensures the FET can withstand short-term high-power events.

Maximum Power Dissipation (Abs): 53 W

High power dissipation rating allows for reliable performance in demanding conditions.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style is ideal for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and efficiency.

Maximum Operating Temperature: 150 °C

High maximum operating temperature range suitable for a variety of operating conditions.

Transistor Element Material: SILICON

Silicon material ensures high performance and reliability.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in cold environments.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability.

Maximum Drain Current (ID): 5.4 A

High maximum drain current capability suitable for various applications.

Maximum Drain-Source On Resistance: 1.4 ohm

Low drain-source on resistance ensures minimal power loss.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, suitable for controlled environments.

Case Connection: DRAIN

Drain case connection ensures easy integration into circuits.

Technical Specifications

Power Field Effect Transistors (FET) IPD70R1K4CEAUMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

26 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

700 V

Maximum Drain Current (ID):

5.4 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

8.3 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD70R1K4CEAUMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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