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IPD70N10S3L12ATMA1

Infineon Technologies

IPD70N10S3L12ATMA1 by Infineon Technologies

IPD70N10S3L12ATMA1 by Infineon is a N-CHANNEL Power FET with 100V DS Breakdown Voltage, 280A IDM, and 0.0152 ohm RDS(on). It is used in applications requiring high power dissipation up to 125W, such as automotive systems due to AEC-Q101 standard compliance.

Median Price

$1.410

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1,682 parts In-Stock

1+ parts

$1.880

100+ parts

$1.250

1k+ parts

$1.090

10k+ parts

-

1,682

$1.880

$1.250

$1.090

-

Rochester

USA . 15,948 parts In-Stock

1+ parts

-

100+ parts

$1.360

1k+ parts

$1.130

10k+ parts

$1.010

15,948

-

$1.360

$1.130

$1.010

Verical

USA . 7,681 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.413

10k+ parts

$1.262

7,681

-

-

$1.413

$1.262

Arrow

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

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$0.942

7,500

-

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$0.942

Chip1Stop

Japan . 5,000 parts In-Stock

1+ parts

-

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-

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$0.973

5,000

-

-

-

$0.973

Element14

Singapore . 3,357 parts In-Stock

1+ parts

-

100+ parts

$1.408

1k+ parts

$1.184

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3,357

-

$1.408

$1.184

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Future Electronics

Canada . 2,500 parts In-Stock

1+ parts

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$2.210

2,500

-

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-

$2.210

Farnell

UK . 612 parts In-Stock

1+ parts

-

100+ parts

$2.020

1k+ parts

$1.690

10k+ parts

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612

-

$2.020

$1.690

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 888 parts In-Stock

1+ parts

$1.064

100+ parts

-

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-

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888

$1.064

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-

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$1.230

100+ parts

-

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870

$1.230

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Chip Stock

USA . 33,500 parts In-Stock

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33,500

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IBS Electronics

USA . 10,000 parts In-Stock

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$3.100

10,000

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$3.100

Vyrian

USA . 5,310 parts In-Stock

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5,310

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 282 parts In-Stock

1+ parts

$0.440

100+ parts

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282

$0.440

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Ampacity Inc.

Singapore . 5,439 parts In-Stock

1+ parts

$0.820

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5,439

$0.820

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Semicontronic

India . 5,081 parts In-Stock

1+ parts

$0.820

100+ parts

$0.800

1k+ parts

$0.795

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5,081

$0.820

$0.800

$0.795

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Corphita

USA . 791 parts In-Stock

1+ parts

$1.008

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791

$1.008

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Netroflash

USA . 50 parts In-Stock

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$1.230

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50

$1.230

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Modulus Dynamics

Lithuania . 5,350 parts In-Stock

1+ parts

$1.508

100+ parts

$1.448

1k+ parts

$1.387

10k+ parts

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5,350

$1.508

$1.448

$1.387

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Corohmni

South Africa . 342 parts In-Stock

1+ parts

$1.508

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342

$1.508

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Microchip USA

USA . 9,849 parts In-Stock

1+ parts

$7.401

100+ parts

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9,849

$7.401

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Perfect Parts

USA . 25,346 parts In-Stock

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Argo Parts USA

USA . 2,246 parts In-Stock

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2,246

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Continental Prestige Electronics

USA . 1,386 parts In-Stock

1+ parts

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100+ parts

$1.400

1k+ parts

$0.963

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1,386

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$1.400

$0.963

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Overview

Unleash the power of innovation with the IPD70N10S3L12ATMA1 by Infineon Technologies. As a leader in Power Field Effect Transistors, Infineon delivers unparalleled quality and reliability in every product. Ideal for a wide range of applications, this N-channel transistor offers enhanced performance and efficiency. With a maximum pulsing drain current of 280A and a compact package design, customers can trust in the value and benefits that this transistor brings to their projects. Upgrade your technology with the IPD70N10S3L12ATMA1 and experience the difference that only Infineon can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy package provides durability and protection, making the product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel type is known for high efficiency and low power consumption, making this FET suitable for energy-efficient applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can improve overall system efficiency.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying manufacturing processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides precise control over the switching behavior of the FET, leading to more efficient performance.

Maximum Pulsed Drain Current (IDM): 280 A

High pulsed drain current capability allows this FET to handle large bursts of power, making it suitable for high-performance applications.

Avalanche Energy Rating (EAS): 410 mJ

High avalanche energy rating ensures the FET can withstand voltage spikes and surges, increasing overall reliability.

Maximum Drain Current (Abs) (ID): 70 A

High maximum drain current allows for efficient power handling, making this FET suitable for heavy-load applications.

Maximum Power Dissipation (Abs): 125 W

High power dissipation capability ensures the FET can operate under demanding conditions without overheating, leading to improved reliability.

Maximum Drain-Source On Resistance: 0.0152 ohm

Low drain-source on resistance results in minimal power loss and improved efficiency in the circuit.

Maximum Operating Temperature: 175 °C

High operating temperature range allows the FET to function reliably in various environmental conditions, increasing its versatility.

Reference Standard: AEC-Q101

Compliance with automotive industry standards ensures the FET's quality and reliability for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) IPD70N10S3L12ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

410 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

70 A

Maximum Drain Current (ID):

70 A

Maximum Drain-Source On Resistance:

.0152 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

280 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPD70N10S3L12ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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