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IPD65R1K4CFDATMA2

Infineon Technologies

IPD65R1K4CFDATMA2 by Infineon Technologies

IPD65R1K4CFDATMA2 by Infineon is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 8.2A IDM and 26mJ EAS, operating in ENHANCEMENT MODE at -55 to 150°C. The PLASTIC/EPOXY package has GULL WING terminals and a DRAIN connection, suitable for surface mount designs with 1.4Ω RDS(on).

Median Price

$0.584

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

$0.573

1k+ parts

$0.476

10k+ parts

$0.424

15,000

-

$0.573

$0.476

$0.424

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.595

10k+ parts

$0.530

15,000

-

-

$0.595

$0.530

Distributors (In-Stock)

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Vyrian

USA . 4,906 parts In-Stock

1+ parts

-

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4,906

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Digiode

USA . 559 parts In-Stock

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559

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 21,971 parts In-Stock

1+ parts

$0.803

100+ parts

$0.771

1k+ parts

$0.739

10k+ parts

-

21,971

$0.803

$0.771

$0.739

-

Microchip USA

USA . 7,381 parts In-Stock

1+ parts

$3.595

100+ parts

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7,381

$3.595

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AZTECH Wire

Italy . 69 parts In-Stock

1+ parts

$10.250

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69

$10.250

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Ampacity Inc.

Singapore . 1,408 parts In-Stock

1+ parts

$40.050

100+ parts

-

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1,408

$40.050

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QUARKTWIN TECHNOLOGY LTD

USA . 23,821 parts In-Stock

1+ parts

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23,821

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Corphita

USA . 279 parts In-Stock

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279

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unleash the power of cutting-edge technology with the IPD65R1K4CFDATMA2 by Infineon Technologies. Designed for high-performance applications, this N-CHANNEL Power Field Effect Transistor offers unmatched reliability and efficiency. With a maximum operating temperature of 150°C and an avalanche energy rating of 26mJ, this transistor is built to last. Whether you're in need of robust switching capabilities or enhanced power management, the IPD65R1K4CFDATMA2 delivers superior performance every time. Upgrade your systems with the best in class from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the transistor, ensuring reliable performance in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower ON-resistance and higher efficiency compared to P-channel FETs, making them suitable for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can provide protection against voltage spikes, enhancing the reliability of the overall system.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control the flow of current in electronic circuits, making it suitable for power management tasks.

Surface Mount: YES

Surface mount package allows for easy and compact PCB design, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage levels safely, making it suitable for applications requiring robust performance.

Maximum Power Dissipation (Abs): 28.4 W

The high power dissipation capability ensures that the FET can handle large power loads without overheating, contributing to system reliability.

Technical Specifications

Power Field Effect Transistors (FET) IPD65R1K4CFDATMA2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

26 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

2.8 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

8.2 A

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD65R1K4CFDATMA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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