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IPD60R1K4C6

Infineon Technologies

IPD60R1K4C6 by Infineon Technologies

IPD60R1K4C6 by Infineon is a N-CHANNEL FET with 600V DS breakdown voltage, suitable for switching applications. It features a single configuration with built-in diode, 8A max pulsed drain current, and 1.4 ohm max RDS(on). This MOSFET operates in enhancement mode at up to 150°C, making it ideal for high-power applications.

Median Price

$0.334

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rutronik

Germany . 7,500 parts In-Stock

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$0.334

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$0.334

Vyrian

USA . 2,264 parts In-Stock

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2,264

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Digiode

USA . 571 parts In-Stock

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571

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LIBRA Elektronik GmbH

Germany . 205 parts In-Stock

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205

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Nova Conductors

Japan . 77 parts In-Stock

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77

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 17,930 parts In-Stock

1+ parts

$0.310

100+ parts

$0.298

1k+ parts

$0.285

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-

17,930

$0.310

$0.298

$0.285

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Aztec Data Supply Inc.

USA . 61 parts In-Stock

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$1.533

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61

$1.533

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AZTECH Wire

Italy . 588 parts In-Stock

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$13.383

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588

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Ampacity Inc.

Singapore . 615 parts In-Stock

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$40.050

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615

$40.050

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Andel Nordic

Denmark . 26 parts In-Stock

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$49.520

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$34.664

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$34.664

26

$49.520

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$34.664

$34.664

Perfect Parts

USA . 45,015 parts In-Stock

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A-Z Elektronik GmbH

Germany . 11,690 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

USA . 4,945 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,460 parts In-Stock

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Argo Parts USA

USA . 3,599 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,501 parts In-Stock

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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2,500

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Lixinc

USA . 1,379 parts In-Stock

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Continental Prestige Electronics

USA . 1,225 parts In-Stock

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Corphita

USA . 688 parts In-Stock

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688

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Elevate your power management solutions with the IPD60R1K4C6 from Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unrivaled performance in switching applications. With a maximum operating temperature of 150°C and a minimum DS breakdown voltage of 600V, this FET ensures reliability and efficiency. Whether you're designing industrial equipment or automotive systems, this product's high-quality construction and enhanced mode operation deliver the value and benefits you need to take your projects to the next level. Trust in Infineon Technologies for superior technology that powers innovation.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer higher mobility and conductivity compared to P-channel FETs, making them ideal for high-performance switching applications.

Minimum DS Breakdown Voltage: 600 V

High breakdown voltage ensures reliable operation and protection against voltage spikes, making this FET suitable for high voltage applications.

Maximum Pulsed Drain Current (IDM): 8 A

Capable of handling higher current pulses, making it suitable for applications requiring intermittent high power operation.

Maximum Power Dissipation (Abs): 28.4 W

High power dissipation capability allows for efficient handling of power in demanding applications, ensuring reliability and longevity.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand elevated temperatures and operate reliably in harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) IPD60R1K4C6 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

26 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

3.2 A

Maximum Drain Current (ID):

3.2 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

8 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD60R1K4C6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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