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IPA100N08N3G

Infineon Technologies

IPA100N08N3G by Infineon Technologies

Infineon's IPA100N08N3G is a N-CHANNEL FET with 80V DS Breakdown Voltage, 160A IDM, and 0.01 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with 35W power dissipation. The transistor features a built-in diode and can handle up to 175°C operating temperature.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,144 parts In-Stock

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Digiode

USA . 285 parts In-Stock

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285

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Aztec Data Supply Inc.

USA . 4,164 parts In-Stock

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$0.793

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$0.793

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Modulus Dynamics

Lithuania . 9,361 parts In-Stock

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$1.327

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$1.274

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$1.221

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9,361

$1.327

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Corohmni

South Africa . 111 parts In-Stock

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$1.726

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$1.726

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AZTECH Wire

Italy . 575 parts In-Stock

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$8.657

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575

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Semicontronic

India . 1,354 parts In-Stock

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$15.050

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$14.674

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$14.598

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$15.050

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$14.598

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Ampacity Inc.

Singapore . 1,494 parts In-Stock

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$33.050

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$33.050

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Andel Nordic

Denmark . 376 parts In-Stock

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$38.820

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$27.177

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$27.177

376

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$27.177

Lixinc

USA . 19,709 parts In-Stock

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19,709

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A-Z Elektronik GmbH

Germany . 14,394 parts In-Stock

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Continental Prestige Electronics

USA . 4,678 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,816 parts In-Stock

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Argo Parts USA

USA . 3,752 parts In-Stock

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Corphita

USA . 940 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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$2.546

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$2.546

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$2.546

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$2.546

$2.546

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Lucentia Tech

USA . 300 parts In-Stock

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$2.546

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$2.546

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$2.546

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Perfect Parts

USA . 260 parts In-Stock

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Overview

Experience superior performance and reliability with the IPA100N08N3G by Infineon Technologies. This N-CHANNEL Power Field Effect Transistor is designed for switching applications, offering a minimum DS Breakdown Voltage of 80V and maximum Drain Current of 40A. With a package shape of rectangular and terminal form through-hole, this FET provides enhanced efficiency and power management. Trust in Infineon's expertise in semiconductor technology to deliver exceptional quality and value. Upgrade your projects with the IPA100N08N3G for optimal performance and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance and efficiency compared to P-Channel FETs, making this product a good choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves efficiency by reducing the need for external components.

Transistor Application: SWITCHING

This FET is optimized for switching applications, making it ideal for use in power management circuits.

Minimum DS Breakdown Voltage: 80 V

The high breakdown voltage allows for operation in high voltage applications, increasing the versatility of this FET.

Maximum Pulsed Drain Current (IDM): 160 A

The high pulsed drain current rating enables this FET to handle surges in current, making it suitable for applications with varying power requirements.

Maximum Power Dissipation (Abs): 35 W

The high power dissipation rating ensures that this FET can handle high power levels without overheating, improving reliability in demanding conditions.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can withstand elevated temperatures without compromising performance, making it suitable for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) IPA100N08N3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

110 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPA100N08N3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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