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IKP20N65H5

Infineon Technologies

IKP20N65H5 by Infineon Technologies

IKP20N65H5 by Infineon is an N-CHANNEL IGBT with VCEsat of 2.1V, IC of 42A, and Ptot of 125W. Ideal for POWER CONTROL applications due to its fast turn-off time (toff) of 218ns and high collector-emitter voltage rating of 650V. Package style is FLANGE MOUNT with through-hole terminals.

Median Price

$3.200

Lifecycle Status

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6

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1k+

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Mouser Electronics

USA . 364 parts In-Stock

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$3.200

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$1.450

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$1.150

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364

$3.200

$1.450

$1.150

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Chip1Stop

Japan . 500 parts In-Stock

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500

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Vyrian

USA . 50 parts In-Stock

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$1.550

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$1.550

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Digiode

USA . 863 parts In-Stock

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$2.736

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$2.736

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Maritex

Poland . 6,286 parts In-Stock

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$3.679

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Nova Conductors

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Modulus Dynamics

Lithuania . 13,656 parts In-Stock

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$1.086

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$1.043

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$0.999

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13,656

$1.086

$1.043

$0.999

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Corohmni

South Africa . 140 parts In-Stock

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$1.897

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Corphita

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Ampacity Inc.

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$5.330

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AZTECH Wire

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Argo Parts USA

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Overview

Upgrade your power control systems with the IKP20N65H5 from Infineon Technologies. Designed to deliver high performance and reliability, this N-channel insulated gate bipolar transistor is perfect for a variety of applications. With a maximum collector-emitter voltage of 650V and a maximum collector current of 42A, this transistor ensures efficient power management. Trust in Infineon Technologies' reputation for quality and innovation, and experience the value and benefits that the IKP20N65H5 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation and protection for the transistor, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency compared to P-channel IGBTs, making them a good choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves efficiency by allowing for easy freewheeling of inductive loads.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for high-power switching and efficient energy management.

Maximum VCEsat: 2.1 V

The low VCEsat value indicates minimal voltage drop across the collector-emitter junction, leading to lower power dissipation and improved efficiency.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient mounting and thermal management, enabling the IGBT to handle high power levels without overheating.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections, making installation and soldering easy and ensuring long-term performance.

Nominal Turn Off Time (toff): 218 ns

The fast turn-off time of 218 ns reduces switching losses and improves efficiency in power control applications, allowing for rapid and precise on/off control.

Maximum Power Dissipation (Abs): 125 W

With a maximum power dissipation of 125 W, this IGBT can handle high power levels without overheating, ensuring reliable operation in demanding conditions.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers mechanical stability and easy installation in various applications, providing additional protection and heat dissipation.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175°C allows the IGBT to operate in harsh environments and high-power applications without compromising performance.

Maximum Collector-Emitter Voltage: 650 V

The high maximum collector-emitter voltage rating of 650 V enables the IGBT to handle high voltages and power levels, making it suitable for a wide range of power control applications.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its high efficiency and reliability, ensuring stable performance and durability in the IGBT.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage of 20 V allows for precise control of the IGBT, ensuring efficient switching and optimal performance in power control applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the IGBT to operate in cold environments or during startup without compromising performance.

Maximum Collector Current (IC): 42 A

With a high maximum collector current rating of 42 A, this IGBT can handle high current loads and power levels, making it suitable for power control applications with high current requirements.

Maximum Gate-Emitter Threshold Voltage: 4.8 V

The gate-emitter threshold voltage of 4.8 V ensures reliable and precise control of the IGBT, allowing for efficient switching and optimal performance in power control applications.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and long-term performance of the IGBT.

Terminal Position: SINGLE

The single terminal position simplifies installation and ensures proper alignment, making it easy to integrate the IGBT into various circuit configurations.

Case Connection: COLLECTOR

The collector case connection enables efficient heat dissipation and reliable current flow, ensuring stable operation and long-term performance of the IGBT.

Nominal Turn On Time (ton): 28 ns

The fast turn-on time of 28 ns allows for quick response and precise control of the IGBT, making it ideal for high-speed switching and power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKP20N65H5 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

4.8 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

218 ns

Nominal Turn On Time (ton):

28 ns

Maximum VCEsat:

2.1 V

Trade Compliance

IKP20N65H5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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