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FM24C04B-G

Infineon Technologies

FM24C04B-G by Infineon Technologies

Infineon's FM24C04B-G FRAM features 512x8 organization, operates at 5V with 1MHz clock frequency. Ideal for automotive applications due to AEC-Q100 screening, it offers 100000000000000 write/erase cycles and I2C serial bus interface.

Median Price

$1.510

Lifecycle Status

Suppliers In-Stock

31

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 640 parts In-Stock

1+ parts

$1.140

100+ parts

$1.080

1k+ parts

-

10k+ parts

$0.954

640

$1.140

$1.080

-

$0.954

Arrow

USA . 3,217 parts In-Stock

1+ parts

$1.249

100+ parts

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3,217

$1.249

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Element14

Singapore . 1,765 parts In-Stock

1+ parts

$1.689

100+ parts

$1.428

1k+ parts

$1.339

10k+ parts

$1.205

1,765

$1.689

$1.428

$1.339

$1.205

Farnell

UK . 1,765 parts In-Stock

1+ parts

$1.881

100+ parts

$1.388

1k+ parts

$1.310

10k+ parts

$1.209

1,765

$1.881

$1.388

$1.310

$1.209

Mouser Electronics

USA . 5,154 parts In-Stock

1+ parts

$1.980

100+ parts

$1.690

1k+ parts

$1.500

10k+ parts

$1.040

5,154

$1.980

$1.690

$1.500

$1.040

Newark

USA . 3,982 parts In-Stock

1+ parts

$2.010

100+ parts

$1.590

1k+ parts

$1.490

10k+ parts

$1.390

3,982

$2.010

$1.590

$1.490

$1.390

Flip Electronics (Authorized)

USA . 47,136 parts In-Stock

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47,136

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Verical

USA . 32,010 parts In-Stock

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$1.484

32,010

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$1.484

Rochester

USA . 7,724 parts In-Stock

1+ parts

-

100+ parts

$1.510

1k+ parts

$1.250

10k+ parts

$1.120

7,724

-

$1.510

$1.250

$1.120

DigiKey

USA . 4,048 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.030

10k+ parts

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4,048

-

-

$1.030

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Future Electronics

Canada . 984 parts In-Stock

1+ parts

-

100+ parts

$1.050

1k+ parts

$1.010

10k+ parts

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984

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$1.050

$1.010

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RS (Exports)

UK . 484 parts In-Stock

1+ parts

-

100+ parts

$1.729

1k+ parts

$1.484

10k+ parts

$1.438

484

-

$1.729

$1.484

$1.438

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 206 parts In-Stock

1+ parts

$1.074

100+ parts

-

1k+ parts

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206

$1.074

-

-

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$1.444

100+ parts

-

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10k+ parts

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700

$1.444

-

-

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Component Electronics Inc.

Canada . 18 parts In-Stock

1+ parts

$1.920

100+ parts

$1.440

1k+ parts

$1.250

10k+ parts

-

18

$1.920

$1.440

$1.250

-

SOS electronic

Slovakia . 15 parts In-Stock

1+ parts

$2.485

100+ parts

$2.245

1k+ parts

$2.125

10k+ parts

-

15

$2.485

$2.245

$2.125

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TME

Poland . 591 parts In-Stock

1+ parts

$2.500

100+ parts

$2.230

1k+ parts

$2.150

10k+ parts

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591

$2.500

$2.230

$2.150

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Flip Electronics

USA . 96,606 parts In-Stock

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96,606

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Chip Stock

USA . 33,500 parts In-Stock

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33,500

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Vyrian

USA . 6,838 parts In-Stock

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Component Sense

UK . 6,002 parts In-Stock

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6,002

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IBS Electronics

USA . 4,307 parts In-Stock

1+ parts

-

100+ parts

$1.571

1k+ parts

$1.557

10k+ parts

$0.961

4,307

-

$1.571

$1.557

$0.961

A&K Electronics

USA . 1,648 parts In-Stock

1+ parts

-

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1,648

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Rotakorn

Sweden . 1,648 parts In-Stock

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1,648

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Bristol Electronics

USA . 1,648 parts In-Stock

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1,648

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ACDS - Activité Composants Distribution Service

France . 590 parts In-Stock

1+ parts

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590

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Micros

Poland . 500 parts In-Stock

1+ parts

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100+ parts

$0.888

1k+ parts

$0.860

10k+ parts

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500

-

$0.888

$0.860

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Partservice

France . 280 parts In-Stock

1+ parts

-

100+ parts

$0.855

1k+ parts

$0.830

10k+ parts

$0.830

280

-

$0.855

$0.830

$0.830

Schukat

Germany . 140 parts In-Stock

1+ parts

-

100+ parts

$1.351

1k+ parts

$1.297

10k+ parts

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140

-

$1.351

$1.297

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ComSIT Distribution GmbH

Germany . 94 parts In-Stock

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94

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Semi Source

USA . 30 parts In-Stock

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30

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 300 parts In-Stock

1+ parts

$1.017

100+ parts

-

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300

$1.017

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Argo Parts USA

USA . 1,517 parts In-Stock

1+ parts

$1.444

100+ parts

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1,517

$1.444

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.444

100+ parts

-

1k+ parts

$1.372

10k+ parts

$1.343

1,000

$1.444

-

$1.372

$1.343

Continental Prestige Electronics

USA . 1,382 parts In-Stock

1+ parts

$1.900

100+ parts

$1.320

1k+ parts

$1.250

10k+ parts

-

1,382

$1.900

$1.320

$1.250

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Perfect Parts

USA . 11,258 parts In-Stock

1+ parts

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11,258

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QUARKTWIN TECHNOLOGY LTD

USA . 10,543 parts In-Stock

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10,543

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Kepictronics

USA . 3,634 parts In-Stock

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3,634

-

-

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iodParts Technologies Inc.

India . 1,853 parts In-Stock

1+ parts

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1,853

-

-

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

-

-

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Cyclops Electronics Ltd (Excess)

UK . 590 parts In-Stock

1+ parts

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590

-

-

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Metaverse IC Inc.

Canada . 466 parts In-Stock

1+ parts

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466

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Futuretech Components

Singapore . 250 parts In-Stock

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250

-

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Component Stockers USA

USA . 245 parts In-Stock

1+ parts

-

100+ parts

$1.100

1k+ parts

$1.050

10k+ parts

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245

-

$1.100

$1.050

-

Overview

Unlock the power of data storage with the FM24C04B-G by Infineon Technologies. Built with high-quality materials and advanced technology, this FRAM offers unparalleled reliability and endurance for a wide range of applications. With a maximum clock frequency of 1 MHz and a memory density of 4096 bits, this memory IC provides fast and efficient data processing. Whether you're designing automotive systems or industrial equipment, the FM24C04B-G delivers value, benefits, and advantages that will elevate your product to the next level. Experience the difference with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Screening Level: AEC-Q100

Ensures high reliability and performance in automotive applications, meeting industry standards.

Package Shape: RECTANGULAR

The compact rectangular shape allows for efficient use of space on the PCB.

Operating Mode: SYNCHRONOUS

Synchronous operation enables fast and precise data transfer, improving overall system efficiency.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, ensuring compatibility with a wide range of systems.

Power Supplies (V): 5

Consistent power supply ensures stable performance and reliable operation.

No. of Terminals: 8

Sufficient number of terminals for connectivity and integration within a system.

Package Style (Meter): SMALL OUTLINE

Compact form factor saves space on the PCB, making it suitable for small devices.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, increasing versatility and flexibility.

Organization: 512X8

Organized memory structure allows for efficient data storage and retrieval.

Minimum Standby Voltage: 4.5 V

Low standby voltage helps conserve power, ideal for energy-efficient applications.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature environments, suitable for a variety of conditions.

Terminal Finish: PURE TIN

Pure tin finish ensures good electrical conductivity and reliability in contact connections.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation and layout on the PCB.

Write Protection: HARDWARE

Hardware-based write protection enhances data security and prevents unauthorized access.

Maximum Seated Height: 1.727 mm

Low profile design allows for compact integration in space-constrained applications.

Maximum Clock Frequency (fCLK): 1 MHz

High clock frequency enables fast data transfer speeds, improving overall performance.

Width: 3.8985 mm

Slim width allows for efficient use of space on the PCB, suitable for compact designs.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage ensures compatibility with a wide range of systems.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for safe and reliable soldering during assembly, ensuring product quality.

Peak Reflow Temperature °C: 260

Withstands high temperatures during reflow soldering, ensuring product reliability.

Length: 4.889 mm

Compact length saves space on the PCB, ideal for small form factor devices.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making it energy-efficient.

Parallel or Serial: SERIAL

Serial data transfer mode allows for simplified communication and efficient data exchange.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and stability during installation.

Maximum Supply Current: 0.4 mA

Low supply current consumption helps conserve power and extend battery life.

No. of Words: 512 words

Sufficient memory capacity for storing a large amount of data or code.

Memory Width: 8

Data width of 8 provides efficient data handling and processing capabilities.

Minimum Data Retention Time: 10

Long data retention time ensures data integrity and reliability over an extended period.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration and compatibility with common PCB designs.

No. of Words Code: 512

Number of words in the code ensures compatibility and efficient data handling.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates good resistance to moisture, suitable for a variety of environments.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for operation at higher voltage levels, increasing flexibility in system design.

Endurance: 100000000000000 Write/Erase Cycles

High endurance rating ensures long-lasting performance and reliability for frequent read/write operations.

Serial Bus Type: I2C

I2C communication protocol enables easy interfacing with other devices, enhancing compatibility and flexibility.

Memory Density: 4096 bit

High memory density provides ample storage capacity for data-intensive applications.

Memory IC Type: FRAM

FRAM technology offers fast read/write speeds and reliable data retention, making it a preferred choice for memory applications.

Maximum Standby Current: 0.00001 Amp

Ultra-low standby current consumption helps conserve power, ideal for battery-operated devices.

Technical Specifications

FRAMs FM24C04B-G attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.889 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.727 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.00001 Amp

Minimum Standby Voltage:

4.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

.4 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.8985 mm

Write Protection:

HARDWARE

Trade Compliance

FM24C04B-G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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