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DD540N22KHPSA2

Infineon Technologies

DD540N22KHPSA2 by Infineon Technologies

Infineon's DD540N22KHPSA2 is a series-connected rectifier diode with 2 elements, offering a max output current of 540A and a max repetitive peak reverse voltage of 2200V. This plastic/epoxy diode operates b/w -40°C to 150°C, making it suitable for high-power applications requiring efficient rectification.

Median Price

$267.880

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1 parts In-Stock

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$252.840

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$252.840

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DigiKey

USA . 2 parts In-Stock

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$266.530

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$266.530

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Arrow

USA . 1 parts In-Stock

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$267.880

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$267.880

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Verical

USA . 1 parts In-Stock

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$267.880

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$267.880

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Chip1Stop

Japan . 1 parts In-Stock

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$267.880

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$267.880

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Newark

USA . 1 parts In-Stock

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$376.550

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$376.550

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Digiode

USA . 384 parts In-Stock

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$253.204

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384

$253.204

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Nova Conductors

Japan . 650 parts In-Stock

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$360.330

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650

$360.330

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Vyrian

USA . 7,149 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 860 parts In-Stock

1+ parts

$17.109

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860

$17.109

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Corphita

USA . 35 parts In-Stock

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$239.877

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$239.877

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Continental Prestige Electronics

USA . 5 parts In-Stock

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$273.410

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$273.410

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Modulus Dynamics

Lithuania . 32,142 parts In-Stock

1+ parts

$317.890

100+ parts

$305.174

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$292.459

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32,142

$317.890

$305.174

$292.459

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Aranea Global

USA . 1,000 parts In-Stock

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$353.123

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$338.998

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$353.123

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$338.998

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Component Stockers USA

USA . 4 parts In-Stock

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$360.000

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$360.000

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Argo Parts USA

USA . 1,929 parts In-Stock

1+ parts

$360.330

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$356.727

1k+ parts

$353.123

10k+ parts

$349.520

1,929

$360.330

$356.727

$353.123

$349.520

Ampacity Inc.

Singapore . 1 parts In-Stock

1+ parts

$493.080

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1

$493.080

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Microchip USA

USA . 10,139 parts In-Stock

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10,139

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Discover the DD540N22KHPSA2 by Infineon Technologies, a top-of-the-line rectifier diode with unparalleled quality and reliability. Manufactured by Infineon Technologies, a leader in the industry, this product offers exceptional value with its high performance and durable construction. Ideal for a wide range of applications, this diode is a versatile solution for various electronic projects. Trust in the expertise and innovation of Infineon Technologies to deliver top-notch products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the diodes, ensuring a longer lifespan.

Config: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

The series connected configuration and 2 elements make this product suitable for applications requiring higher voltage and current requirements.

Maximum Reverse Current: 40000 uA

The high maximum reverse current rating ensures efficient performance even under reverse bias conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for easy installation and placement in various electronic devices.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliability and stability in a wide range of operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance.

Maximum Output Current: 540 A

The high maximum output current rating makes this diode suitable for high-power applications.

Maximum Repetitive Peak Reverse Voltage: 2200 V

The high maximum repetitive peak reverse voltage rating ensures reliable performance in applications requiring high reverse voltages.

Diode Element Material: SILICON

Silicon diode elements offer high conductivity and efficiency, making this product a reliable choice for various electronic circuits.

Technical Specifications

Diodes & Rectifiers DD540N22KHPSA2 attributes and parameters. Explore more Diodes & Rectifiers devices from Infineon Technologies

Specs

Additional Features:

HIGH RELIABILITY

Application:

GENERAL PURPOSE

Case Connection:

ISOLATED

Config:

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

1.48 V

JESD-30 Code:

R-PUFM-X3

Maximum Non Repetitive Peak Forward Current:

14000 A

No. of Elements:

2

No. of Phases:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

540 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Reference Standard:

UL RECOGNIZED

Maximum Repetitive Peak Reverse Voltage:

2200 V

Maximum Reverse Current:

40000 uA

Surface Mount:

NO

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

DD540N22KHPSA2 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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