Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
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Microchip USA
SRAM CYD36S36V18-200BBXC attributes and parameters. Explore more SRAM devices from Infineon Technologies
Maximum Access Time:
JESD-30 Code:
JESD-609 Code:
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Organization:
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Parallel or Serial:
Qualification:
Maximum Seated Height:
Maximum Supply Voltage (Vsup):
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CYD36S36V18-200BBXC Memory ICs trade compliance attributes, and parameters.
ECCN
3A991.B.2.A
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
2N2222A
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Toshiba
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
SS14
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Silicon Transistor
1N4148WT
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SS495A-SP
Honeywell Sensing And Control
SS495A-SP by Honeywell is a magnetic field sensor with 10.5V max supply voltage, 3" body width, and 1.5% linearity. Ideal for applications requiring a Hall effect sensor with -40 to 150°C operating temperature range, such as position sensing in automotive or industrial systems.
LM358N
Onsemi
Panjit International
NC7WZ17P6X
The Onsemi NC7WZ17P6X is a logic gate with 2 functions, featuring a propagation delay of 13.1 ns at 1.8V supply voltage. Ideal for industrial applications, it operates b/w -40 to 85°C and has a max power supply current of 100mA. With Schmitt Trigger technology and small outline packaging, it suits compact electronic designs requiring fast signal processing.
BAV99W-7-F
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Gec Plessey Semiconductors
ULN2803A
STMicroelectronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; No. of Elements: 8; Minimum DC Current Gain (hFE): 1000;
SMBJ18CA
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
CRCW04020000Z0ED
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0ED is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating b/w -55 to 155 °C, it suits SMT applications in automotive electronics due to AEC-Q200 compliance and 0.063 W power dissipation.
1N5819HW-7-F
1N5819HW-7-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 1A output current, and 0.75V forward voltage. It's a surface mount device in a small outline package ideal for efficiency applications at temperatures ranging from -65 to 125°C.
CY62148GN-45SXI
Infineon Technologies
CY62148GN-45SXI by Infineon Technologies is a 512Kx8 SRAM with 45ns access time, operating at 5V. It features a small outline package, GULL WING terminals, and industrial temperature grade. Ideal for applications requiring fast and reliable parallel memory storage in harsh environments.
23LCV1024-I/P
Microchip Technology
Microchip Technology's 23LCV1024-I/P is a CMOS SRAM with 128KX8 organization, operating at up to 20 MHz. It has separate I/O, operates synchronously, and supports a supply voltage range of 2.5-5.5 V. Ideal for industrial applications requiring high-speed memory access in a compact IN-LINE package.
CY62256VNLL-70SNXI
Cypress Semiconductor
CY62256VNLL-70SNXI by Cypress is a 32Kx8 SRAM with 70ns access time, operating at 3V. It features asynchronous mode, common I/O type, and 3-state output. Ideal for industrial applications requiring fast and reliable memory storage in a compact small outline package.
CY7C1061G30-10BVJXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;
CY62148EV30LL-45BVXI
Infineon's CY62148EV30LL-45BVXI is a 512Kx8 SRAM with 3.6V max supply voltage, 45ns access time, and 85°C operating temp. Ideal for industrial applications requiring fast and reliable memory storage in a compact grid array package.
71024S20YGI
Renesas Electronics
Renesas Electronics 71024S20YGI is a 128Kx8 SRAM with 3-STATE output, operating at 5V. It has a max access time of 20ns and can store up to 131072 words. Ideal for industrial applications requiring fast and reliable memory storage in a compact small outline package.
IS61WV51216EDBLL-10TLI
Integrated Silicon Solution
IS61WV51216EDBLL-10TLI by Integrated Silicon Solution is a 512Kx16 SRAM with 10ns access time, operating at 3.3V. It features a small outline package suitable for industrial temperature grades. Ideal for applications requiring fast and reliable memory storage in compact electronic devices.
CY14V104NA-BA45XI
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words: 262144 words;
CY7C1021DV33-10ZSXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Standby Voltage: 2 V;
APS6404L-3SQRX-SN
Ap Memory Technology
APS6404L-3SQRX-SN by Ap Memory Technology is an 8MX8 SRAM with synchronous operation, 133 MHz clock frequency, and 67108864 bit memory density. It is ideal for applications requiring high-speed data processing in a compact form factor. The package features a small outline design with gull wing terminals for easy surface mounting.
IDT71V016SA20PHGI8
Integrated Device Technology
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
5962-8685909LA
Defense Logistics Agency
Defense Logistics Agency's 5962-8685909LA SRAM features 16KX4 organization, CMOS technology, and 35 ns max access time. Ideal for military applications with MIL-STD-883 screening level, operating at -55 to 125 °C temperature range. Package style is in-line with ceramic body material and dual terminal position.
CY7C1061G30-10BVJXIT by Infineon Technologies is a 1MX16 SRAM with 10ns access time, operating at 3V. It features a very thin profile grid array package and operates in industrial temperature range. Ideal for high-speed parallel memory applications requiring fast data access and reliable performance.
IDT7007L20JGI8
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 68; Package Code: PGA; Package Shape: SQUARE; Organization: 32KX8;
CY62167EV30LL-45ZXI
CY62167EV30LL-45ZXI by Infineon Technologies is a 1MX16 SRAM with 3.6V max supply voltage, 45ns access time, and operates in industrial temperature range. It is commonly used in applications requiring fast and reliable data storage such as networking equipment, industrial automation systems, and telecommunications devices.
CY62128EV30LL-45ZXI
Infineon's CY62128EV30LL-45ZXI is a 128Kx8 SRAM with 45ns access time, operating at 3V. It features asynchronous mode, common I/O type, and 3-state output characteristics. Ideal for industrial applications requiring fast memory access in a compact package.
IDT71256SA20YGI8
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOJ; Package Shape: RECTANGULAR; JESD-609 Code: e3;
IDT70V27L20PFGI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
5962-8685916LA
STMicroelectronics' 5962-8685916LA is a MIL-STD-883 compliant SRAM with 16KX4 organization, operating in asynchronous mode at 5V. It features a memory density of 65536 bit, parallel interface, and max access time of 45 ns. Ideal for military applications requiring fast and reliable data storage.
5962-8685920YA
Micron Technology
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 22; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Technology: CMOS;
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CYD36S18V18-133BGXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Organization: 2MX18;
CYD36S18V18-133BGXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Length: 27 mm;
CYD36S36V18-133BGXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Words: 1048576 words;
CYD36S36V18-133BGXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 20;
CYD36S36V18-167BBXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B484;
CYD36S36V18-167BBXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 1.58 V;
CYD36S72V18-133BGXC
CYD36S72V18-133BGXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;
CYD36S72V18-167BGI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
CYD36S36V18-200BBXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Length: 23 mm;
CYD36S36V18-133BBC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 1.58 V;
CYD36S36V18-133BBI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
CYD36S36V18-167BBC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Width: 23 mm;
CYD36S36V18-167BBI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Terminal Form: BALL;
CYD36S36V18-200BBC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Memory Density: 37748736 bit;
CYD36S36V18-167BGC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Access Time: 11 ns;
CYD36S36V18-200BGC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA484,22X22,40;
CYD36S36V18-200BGXC
Supply Digital Components
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