Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
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$5.091
Component Stockers USA
$99.990
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$4.989
Corphita
Microchip USA
SRAM CYD36S36V18-200BBXC attributes and parameters. Explore more SRAM devices from Infineon Technologies
Maximum Access Time:
JESD-30 Code:
JESD-609 Code:
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Organization:
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Qualification:
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Maximum Supply Voltage (Vsup):
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CYD36S36V18-200BBXC Memory ICs trade compliance attributes, and parameters.
ECCN
3A991.B.2.A
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
MBR0520LT1
Motorola
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Onsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Temic Semiconductors
RC0805FR-0710RL
Yageo
Yageo's RC0805FR-0710RL is a 10 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. With a temperature range of -55 to 155 °C, it suits applications requiring precise resistance values in compact surface mount designs.
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
2N2222A
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Uniohm
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Renesas Electronics
SS14
Hy Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
Micro Commercial Components
06035C104KAT2A
KYOCERA AVX
06035C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
CY62148ESL-55ZAXI
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TSSOP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
71321LA55PPGI
Integrated Device Technology
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE; Memory Density: 16384 bit;
CY14B108M-ZSP45XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Equivalence Code: TSOP54,.46,32;
IS61WV10248BLL-10TLI
Integrated Silicon Solution
IS61WV10248BLL-10TLI by Integrated Silicon Solution is a 1MX8 SRAM with 3-STATE output, operating at 3.6V max supply voltage and 10ns access time. Ideal for industrial applications requiring fast and reliable memory storage in a small outline package.
CY62256NLL-55SNXI
CY62256NLL-55SNXI by Cypress Semiconductor is a 32Kx8 SRAM with 55ns access time, operating at 5V. It features asynchronous mode, 3-STATE output, and common I/O type. Widely used in industrial applications for fast data storage and retrieval due to its high memory density and parallel interface.
CY62167EV30LL-45BVI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
CY62256NLL-70SNXCT
CY62256NLL-70SNXCT by Cypress Semiconductor is a 32Kx8 SRAM with 70ns access time, operating at 5V. It features asynchronous mode, 3-STATE output, and common I/O type. Ideal for applications requiring fast and reliable memory storage in commercial-grade devices.
CY62167G30-45BVXA
Infineon's CY62167G30-45BVXA is a 1MX16 SRAM with 45ns access time, operating at 3.6V. It features a very thin profile grid array package suitable for industrial applications requiring fast and reliable memory storage. With common I/O type and output enable function, it offers high-speed parallel data processing capabilities in harsh environments.
DS1225Y-150+
DS1225Y-150+ by Maxim Integrated is an 8Kx8 SRAM with 150ns access time. Operating at 5V, it offers non-volatile memory with 65536-bit density. Ideal for commercial applications requiring fast and reliable asynchronous memory storage.
709089L12PFI8
Integrated Device Technology's 709089L12PFI8 is a 64Kx8 MULTI-PORT SRAM with 25ns access time, operating at up to 50MHz clock frequency. Ideal for industrial applications, this CMOS technology memory IC features synchronous operation and common I/O type in a low profile flatpack package.
AS6C1008-55PCN
Alliance Memory
Alliance Memory's AS6C1008-55PCN is a 128Kx8 SRAM with 55ns access time, operating at 3V. It features asynchronous mode, 3-state output, and common I/O type. Ideal for applications requiring fast read/write operations in commercial temperature environments.
HM628128BLFP-7
Hitachi
Hitachi's HM628128BLFP-7 is a 128Kx8 SRAM with 70ns access time, operating at 5V. It features a small outline package, Gull Wing terminals, and 3-state output for parallel applications in commercial temperature environments.
5962-8855203YA
Qp Semiconductor
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Organization: 32KX8;
DS1220Y-200+
DS1220Y-200+ by Maxim Integrated is a 2Kx8 SRAM with 5V supply, operating in asynchronous mode. It has a memory density of 16384 bit and max access time of 200ns. Ideal for commercial applications requiring non-volatile memory storage.
CY62128EV30LL-45SXI
Infineon's CY62128EV30LL-45SXI is a 128Kx8 SRAM with 3.6V max supply voltage, 45ns access time, and operates in industrial temperature range. It features common I/O type and 1.27mm terminal pitch for parallel applications in small outline packages.
71342LA20PFG8
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Memory Width: 8;
7130LA25JGI8
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; Terminal Finish: MATTE TIN;
AS6C4008-55ZIN
Alliance Memory's AS6C4008-55ZIN is a 512Kx8 SRAM with a max access time of 55ns. It operates asynchronously and has a power supply range of 3V to 5V. This memory IC is commonly used in industrial applications requiring fast and reliable data storage.
CY7C1071DV33-12BAXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
71321LA20PFG
Renesas Electronics' 71321LA20PFG is a 2Kx8 MULTI-PORT SRAM with 20ns access time, operating at 5V. It features a low profile flatpack package, suitable for commercial temperature grade applications. With 3-state output characteristics and common I/O type, it's ideal for parallel data processing in various electronic systems.
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CYD36S18V18-133BGXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Organization: 2MX18;
CYD36S18V18-133BGXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Length: 27 mm;
CYD36S36V18-133BGXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Words: 1048576 words;
CYD36S36V18-133BGXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 20;
CYD36S36V18-167BBXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B484;
CYD36S36V18-167BBXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 1.58 V;
CYD36S72V18-133BGXC
CYD36S72V18-133BGXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;
CYD36S72V18-167BGI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
CYD36S36V18-200BBXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Length: 23 mm;
CYD36S36V18-133BBC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 1.58 V;
CYD36S36V18-133BBI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
CYD36S36V18-167BBC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Width: 23 mm;
CYD36S36V18-167BBI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Terminal Form: BALL;
CYD36S36V18-200BBC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Memory Density: 37748736 bit;
CYD36S36V18-167BGC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Access Time: 11 ns;
CYD36S36V18-200BGC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA484,22X22,40;
CYD36S36V18-200BGXC
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