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CY15B104QN-50SXI

Infineon Technologies

CY15B104QN-50SXI by Infineon Technologies

Infineon's CY15B104QN-50SXI is a 512Kx8 FRAM with 50MHz clock frequency, SPI serial bus, and 3V supply voltage. Ideal for applications requiring high endurance, such as industrial automation systems and IoT devices due to its 1000000000000000 write/erase cycles capability.

Median Price

$15.800

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 71 parts In-Stock

1+ parts

$15.260

100+ parts

$12.160

1k+ parts

-

10k+ parts

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71

$15.260

$12.160

-

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Chip1Stop

Japan . 655 parts In-Stock

1+ parts

$15.800

100+ parts

-

1k+ parts

-

10k+ parts

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655

$15.800

-

-

-

DigiKey

USA . 1,215 parts In-Stock

1+ parts

$15.930

100+ parts

$13.660

1k+ parts

$12.790

10k+ parts

-

1,215

$15.930

$13.660

$12.790

-

Mouser Electronics

USA . 653 parts In-Stock

1+ parts

$15.930

100+ parts

$13.320

1k+ parts

$12.430

10k+ parts

-

653

$15.930

$13.320

$12.430

-

Newark

USA . 461 parts In-Stock

1+ parts

$16.410

100+ parts

$13.720

1k+ parts

$13.440

10k+ parts

-

461

$16.410

$13.720

$13.440

-

Element14

Singapore . 71 parts In-Stock

1+ parts

$28.380

100+ parts

$22.420

1k+ parts

-

10k+ parts

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71

$28.380

$22.420

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Verical

USA . 5,640 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$13.416

10k+ parts

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5,640

-

-

$13.416

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Avnet

USA . 1,504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.256

10k+ parts

$8.735

1,504

-

-

$9.256

$8.735

Arrow

USA . 470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$11.374

10k+ parts

-

470

-

-

$11.374

-

RS (Exports)

UK . 408 parts In-Stock

1+ parts

-

100+ parts

$22.410

1k+ parts

$19.871

10k+ parts

-

408

-

$22.410

$19.871

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Rochester

USA . 70 parts In-Stock

1+ parts

-

100+ parts

$8.740

1k+ parts

$7.820

10k+ parts

$7.360

70

-

$8.740

$7.820

$7.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 241 parts In-Stock

1+ parts

$14.497

100+ parts

-

1k+ parts

-

10k+ parts

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241

$14.497

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$18.340

100+ parts

-

1k+ parts

-

10k+ parts

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50

$18.340

-

-

-

Flip Electronics

USA . 8,460 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,460

-

-

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Vyrian

USA . 1,291 parts In-Stock

1+ parts

-

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1,291

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ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

1+ parts

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8

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$10.300

100+ parts

$9.785

1k+ parts

$9.785

10k+ parts

-

20

$10.300

$9.785

$9.785

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Ampacity Inc.

Singapore . 1,255 parts In-Stock

1+ parts

$11.360

100+ parts

-

1k+ parts

-

10k+ parts

-

1,255

$11.360

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-

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Corphita

USA . 875 parts In-Stock

1+ parts

$13.734

100+ parts

-

1k+ parts

-

10k+ parts

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875

$13.734

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-

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Component Stockers USA

USA . 4,061 parts In-Stock

1+ parts

$17.220

100+ parts

$14.030

1k+ parts

$13.630

10k+ parts

-

4,061

$17.220

$14.030

$13.630

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Continental Prestige Electronics

USA . 1,228 parts In-Stock

1+ parts

$17.970

100+ parts

$14.280

1k+ parts

-

10k+ parts

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1,228

$17.970

$14.280

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$18.340

100+ parts

-

1k+ parts

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10k+ parts

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2,000

$18.340

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-

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Argo Parts USA

USA . 3,787 parts In-Stock

1+ parts

-

100+ parts

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3,787

-

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Authorized Procurement Solutions

USA . 600 parts In-Stock

1+ parts

-

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600

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Infinite Electronics LLP (Excess)

. 475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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475

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-

-

Overview

Unlock the power of seamless data storage and retrieval with the CY15B104QN-50SXI by Infineon Technologies. Boasting unparalleled quality and reliability, this FRAM memory module offers lightning-fast performance in a compact package. Whether you're in need of secure data logging, industrial automation, or IoT applications, this product delivers unmatched value with its high endurance and low power consumption. Say goodbye to data loss worries and hello to efficiency with the CY15B104QN-50SXI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and enabling mass production.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination, making the product suitable for applications requiring synchronized data processing.

Nominal Supply Voltage / Vsup (V): 3

Operating at a standard supply voltage of 3V ensures compatibility with many electronic systems and helps optimize power consumption.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand heat and operate reliably in various environments.

Write Protection: HARDWARE/SOFTWARE

Offering both hardware and software write protection options enhances data security and prevents accidental or unauthorized modification of stored information.

Technology: CMOS

CMOS technology provides low power consumption, allowing the product to operate efficiently and extend battery life in portable devices.

Technical Specifications

FRAMs CY15B104QN-50SXI attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

50 MHz

Minimum Data Retention Time:

10

Endurance:

1000000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

5.28 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.03 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00007 Amp

Minimum Standby Voltage:

3 V

Maximum Supply Current:

3.7 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.23 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15B104QN-50SXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.2

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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