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CY15B102N-ZS60XA

Infineon Technologies

CY15B102N-ZS60XA by Infineon Technologies

Infineon's CY15B102N-ZS60XA FRAM offers 128KX16 organization, operates at 3.3V with 33 MHz clock frequency. Ideal for applications requiring high endurance, such as industrial automation and automotive systems due to its 100000000000000 Write/Erase cycles capability.

Median Price

$20.240

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 27,035 parts In-Stock

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27,035

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Rochester

USA . 3,414 parts In-Stock

1+ parts

-

100+ parts

$19.720

1k+ parts

$17.650

10k+ parts

$16.610

3,414

-

$19.720

$17.650

$16.610

Verical

USA . 3,414 parts In-Stock

1+ parts

-

100+ parts

$24.650

1k+ parts

$22.063

10k+ parts

$20.762

3,414

-

$24.650

$22.063

$20.762

DigiKey

USA . 2,027 parts In-Stock

1+ parts

-

100+ parts

$20.240

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-

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2,027

-

$20.240

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 347 parts In-Stock

1+ parts

$20.872

100+ parts

-

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347

$20.872

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$22.630

100+ parts

-

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10

$22.630

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Flip Electronics

USA . 11,583 parts In-Stock

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11,583

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Vyrian

USA . 7,530 parts In-Stock

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7,530

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DigiKey Marketplace

USA . 2,222 parts In-Stock

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2,222

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,558 parts In-Stock

1+ parts

$17.200

100+ parts

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7,558

$17.200

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Corphita

USA . 636 parts In-Stock

1+ parts

$19.773

100+ parts

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636

$19.773

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Continental Prestige Electronics

USA . 4,424 parts In-Stock

1+ parts

$22.630

100+ parts

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10k+ parts

$22.177

4,424

$22.630

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$22.177

Netroflash

USA . 100 parts In-Stock

1+ parts

$22.630

100+ parts

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$21.498

10k+ parts

$21.046

100

$22.630

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$21.498

$21.046

Microchip USA

USA . 1,227 parts In-Stock

1+ parts

$63.676

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1,227

$63.676

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Component Stockers USA

USA . 170 parts In-Stock

1+ parts

$293.580

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170

$293.580

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Argo Parts USA

USA . 4,262 parts In-Stock

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4,262

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Overview

Unlock the power of reliable data storage with the CY15B102N-ZS60XA by Infineon Technologies. This FRAM memory module offers unparalleled quality and performance, ensuring your data is safe and accessible at all times. With a durable plastic/epoxy package body and compact design, this memory module is ideal for a wide range of applications. From industrial automation to consumer electronics, this product provides value, benefits, and advantages that customers can trust. Experience seamless data storage with the CY15B102N-ZS60XA and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the FRAMs easy to handle and resistant to damage during assembly and operation.

Nominal Supply Voltage / Vsup: 3.3V

The 3.3V supply voltage is common in many electronic devices, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, these FRAMs can withstand harsh environmental conditions and ensure reliable performance in various settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the FRAMs.

Endurance: 100000000000000 Write/Erase Cycles

The high endurance capability of these FRAMs allows for frequent read and write operations without degradation or loss of data, making them ideal for applications requiring frequent updates.

Technical Specifications

FRAMs CY15B102N-ZS60XA attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Maximum Access Time:

70 ns

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

33 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

18.415 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.194 mm

Maximum Standby Current:

.00025 Amp

Minimum Standby Voltage:

2 V

Maximum Supply Current:

12 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

CY15B102N-ZS60XA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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