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CMY210E6327

Infineon Technologies

CMY210E6327 by Infineon Technologies

Infineon Technologies' CMY210E6327 is a RF/Microwave Mixer with 10 dBm CW input power, 50 ohm impedance, and operates from 500-2500 MHz. It is a double balanced component ideal for various RF applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

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Digiode

USA . 595 parts In-Stock

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595

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Vyrian

USA . 175 parts In-Stock

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175

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Nova Conductors

Japan . 42 parts In-Stock

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42

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Modulus Dynamics

Lithuania . 1,119 parts In-Stock

1+ parts

$1.925

100+ parts

$1.848

1k+ parts

$1.771

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1,119

$1.925

$1.848

$1.771

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Ampacity Inc.

Singapore . 375 parts In-Stock

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$16.000

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375

$16.000

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AZTECH Wire

Italy . 338 parts In-Stock

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$17.326

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338

$17.326

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Semicontronic

India . 903 parts In-Stock

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$23.000

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$22.425

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$22.310

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903

$23.000

$22.425

$22.310

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Andel Nordic

Denmark . 3,146 parts In-Stock

1+ parts

$34.570

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$24.197

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$24.197

3,146

$34.570

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$24.197

A-Z Elektronik GmbH

Germany . 4,697 parts In-Stock

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4,697

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Alle Elektronik GmbH

Germany . 3,131 parts In-Stock

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Argo Parts USA

USA . 2,773 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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Continental Prestige Electronics

USA . 927 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Corphita

USA . 86 parts In-Stock

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86

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Overview

Experience superior performance and reliability with the CMY210E6327 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality RF/Microwave Mixers that are perfect for a wide range of applications. With a maximum input power of 10 dBm and a double balanced construction, this component offers unparalleled value and benefits to customers. Whether you're in need of a high-frequency solution for communication systems or radar applications, the CMY210E6327 provides the advantages you need to stay ahead of the competition. Trust in Infineon Technologies for innovation and excellence in every product.

Feature Benefit Bullets

Maximum Input Power (CW): 10 dBm

The high maximum input power allows for reliable and stable performance even at higher power levels, making it suitable for a wide range of applications.

Construction: COMPONENT

The use of high-quality components in the construction ensures durability and longevity of the mixer, making it a reliable choice for long-term use.

RF or Microwave Device Type: DOUBLE BALANCED

Double balanced mixers offer improved suppression of unwanted harmonics and spurious signals, providing cleaner output signals for better overall performance.

Characteristic Impedance: 50 ohm

The 50 ohm characteristic impedance ensures compatibility with standard RF and microwave systems, allowing for easy integration into existing setups.

Minimum Operating Frequency: 500 MHz

The low minimum operating frequency enables the mixer to work effectively across a wide range of frequencies, making it versatile for various applications.

Maximum Operating Frequency: 2500 MHz

With a high maximum operating frequency, this mixer is suitable for high-frequency RF and microwave applications, offering flexibility for a range of uses.

Technical Specifications

RF/Microwave Mixers CMY210E6327 attributes and parameters. Explore more RF/Microwave Mixers devices from Infineon Technologies

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Input Power (CW):

10 dBm

Maximum Operating Frequency:

2500 MHz

Minimum Operating Frequency:

500 MHz

RF or Microwave Device Type:

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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