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BTS441TSAKSA1

Infineon Technologies

BTS441TSAKSA1 by Infineon Technologies

BTS441TSAKSA1 by Infineon is a MOS technology peripheral driver with 5 terminals and built-in protections against transient, over current, over voltage, and thermal issues. It operates at a nominal voltage of 12V with a max of 43V. This rectangular package style device has a turn-on time of 200us and output peak current limit of 21A, making it ideal for buffer or inverter based applications requiring sink output current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,595 parts In-Stock

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VNN

France . 3,270 parts In-Stock

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3,270

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Digiode

USA . 171 parts In-Stock

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171

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AZTECH Wire

Italy . 746 parts In-Stock

1+ parts

$8.800

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746

$8.800

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Aztec Data Supply Inc.

USA . 155 parts In-Stock

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$12.820

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$12.820

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Corohmni

South Africa . 93 parts In-Stock

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$13.779

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93

$13.779

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Modulus Dynamics

Lithuania . 2,331 parts In-Stock

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$14.411

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$13.835

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$13.258

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2,331

$14.411

$13.835

$13.258

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Semicontronic

India . 955 parts In-Stock

1+ parts

$29.500

100+ parts

$28.762

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$28.615

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955

$29.500

$28.762

$28.615

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Ampacity Inc.

Singapore . 451 parts In-Stock

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$38.500

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451

$38.500

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Argo Parts USA

USA . 4,833 parts In-Stock

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Corphita

USA . 539 parts In-Stock

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Continental Prestige Electronics

USA . 293 parts In-Stock

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Microchip USA

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Advanced Electronics

New Zealand . 97 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unleash the power of Infineon Technologies with the BTS441TSAKSA1 peripheral driver! With built-in protections against transients, over current, over voltage, and thermal issues, this rectangular package boasts quality and reliability. Perfect for a wide range of applications, this MOS technology-based device offers a nominal output peak current limit of 21 A and a quick turn-on time of 200 us. Upgrade your projects with the BTS441TSAKSA1 and experience the value and benefits that only Infineon Technologies can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, ideal for various applications.

Maximum Supply Voltage: 43 V

The high maximum supply voltage capability allows the peripheral driver to be used in a wide range of power supply settings without risk of damage.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to integrate the peripheral driver into existing systems or designs with minimal space requirements.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The built-in protections ensure the safety and reliability of the peripheral driver by safeguarding against various electrical faults and potential damage.

No. of Terminals: 5

The 5 terminals provide enough connectivity options for connecting to other components or devices in a circuit.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure and stable mounting of the peripheral driver in place, minimizing the risk of movement or disconnection.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources, making it versatile for various applications.

Terminal Position: ZIG-ZAG

The zig-zag terminal position helps in easy and secure connection of wires or leads to the peripheral driver, ensuring a stable electrical connection.

Technology: MOS

The MOS technology used in the peripheral driver offers high efficiency, low power consumption, and fast switching speeds, making it suitable for high-performance applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for easy and reliable through-board connections, ensuring a secure and durable installation in a circuit.

Nominal Supply Voltage: 12 V

The nominal supply voltage of 12 V provides a standard power input level for the peripheral driver, making it compatible with many common power sources.

Turn-on Time: 200 us

The fast turn-on time of 200 us ensures quick and efficient operation of the peripheral driver, reducing start-up delays in the system.

Nominal Output Peak Current Limit: 21 A

The high nominal output peak current limit of 21 A allows the peripheral driver to deliver sufficient current for driving various loads or components in a circuit.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter based peripheral driver offers versatile options for signal processing and amplification in a circuit, enhancing functionality.

Turn-off Time: 250 us

The relatively short turn-off time of 250 us ensures quick and effective switching off of the peripheral driver, contributing to overall system efficiency.

Output Current Flow Direction: SINK

The sink output current flow direction allows the peripheral driver to effectively control and regulate current flowing from connected devices, ensuring proper functioning and protection.

Technical Specifications

Peripheral Drivers BTS441TSAKSA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PZFM-T5

No. of Functions:

1

No. of Terminals:

5

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

21 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage:

43 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

12 V

Surface Mount:

NO

Technology:

MOS

Terminal Form:

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

250 us

Turn-on Time:

200 us

Trade Compliance

BTS441TSAKSA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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